Inventor · disambiguated record
Che-Min Chu
Also filed as: CHU CHE-MIN
10 granted patents·2 pending applications·72 citations·filing 2010–2020
87Inventor score
Files withPOWERTECH TECHNOLOGY INC7GREENFACE PACKAGING LTD2TAIWAN SEMICONDUCTOR MFG CO LTD2LIN DA-WEN1
Top patents by PatentIndex Score
12 records- 0194US8278179B2LDD epitaxy for FinFETsLIN DA-WEN·Filed 2010·Granted Oct 2, 2012·41 cites·5 claims
- 0288US10276575B2Multi-threshold voltage field effect transistor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·6 cites·20 claims
- 0383US10276510B2Manufacturing method of package structure having conductive shieldPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·4 cites·20 claims
- 0483US9837416B2Multi-threshold voltage field effect transistor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 5, 2017·4 cites·20 claims
- 0581US9825010B2Stacked chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Nov 21, 2017·4 cites·18 claims
- 0673US10607860B2Package structure and chip structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Mar 31, 2020·2 cites·11 claims
- 0760US8853834B2Leadframe-type semiconductor package having EMI shielding layer connected to groundPOWERTECH TECHNOLOGY INC·Filed 2012·Granted Oct 7, 2014·1 cites·13 claims
- 0859USD775896SCupGREENFACE PACKAGING LTD·Filed 2015·Granted Jan 10, 2017·10 cites·1 claims
- 0957US10950557B2Stacked chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Mar 16, 2021·0 cites·13 claims
- 1046US2017287870A1Stacked chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1144US8541870B1Semiconductor package utilizing tape to reinforce fixing of leads to die padPOWERTECH TECHNOLOGY INC·Filed 2012·Granted Sep 24, 2013·0 cites·10 claims
- 1240US2016296049A1Cup with anti-slipping and heat insulation effectsGREENFACE PACKAGING LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →