Inventor · disambiguated record
Chih-Liang Chu
Also filed as: CHU CHIH-LIANG
2 granted patents·4 pending applications·48 citations·filing 2003–2021
64Inventor score
Top patents by PatentIndex Score
6 records- 0184US7396753B2Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the samePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jul 8, 2008·14 cites·7 claims
- 0275US6916685B2Method of plating metal layer over isolated pads on semiconductor package substratePHOENIX PREC TECHNOLOGY CORP·Filed 2003·Granted Jul 12, 2005·34 cites·9 claims
- 0360US2022201853A1Method for manufactunring a multilayer circuit structure having embedded trace layersROHM & HAAS ELECT MAT·Filed 2021·Application pending·0 cites
- 0458US2022201852A1Method for manufactunring a multilayer circuit structure having embedded trace layersROHM & HAAS ELECT MAT·Filed 2021·Application pending·0 cites
- 0544US2009039493A1Packaging substrate and application thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 0637US2004099961A1Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →