Inventor · disambiguated record
Chiang-Jui Chu
Also filed as: CHU CHIANG-JUI
8 granted patents·2 pending applications·32 citations·filing 2016–2025
82Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10
Top patents by PatentIndex Score
10 records- 0196US9761522B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 12, 2017·19 cites·20 claims
- 0294US11901323B2Semiconductor packages having conductive pillars with inclined surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 0394US10163780B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·9 cites·20 claims
- 0482US12272664B2Semiconductor packages having conductive pillars with inclined surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 0581US10720388B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·2 cites·20 claims
- 0678US2025201750A1Semiconductor packages having conductive pillars with inclined surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0776US2025343194A1Integrated circuit, semiconductor package, and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0868US11398444B2Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 0965US12431452B2Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the padsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 30, 2025·0 cites·20 claims
- 1055US11282785B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →