Inventor · disambiguated record
Cheng-Yu Chu
Also filed as: CHU CHENG-YU
23 granted patents·3 pending applications·791 citations·filing 1999–2020
97Inventor score
Top patents by PatentIndex Score
26 records- 0196US6482669B1Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 19, 2002·81 cites·13 claims
- 0296US6426281B1Method to form bump in bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 30, 2002·147 cites·17 claims
- 0393US6605524B1Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 12, 2003·78 cites·24 claims
- 0493US6586323B1Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 1, 2003·76 cites·13 claims
- 0591US7183598B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 27, 2007·10 cites·17 claims
- 0691US6632700B1Method to form a color image sensor cell while protecting the bonding pad structure from damageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 14, 2003·58 cites·20 claims
- 0787US6712260B1Bump reflow method by inert gas plasmaTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 30, 2004·39 cites·61 claims
- 0886US6958546B2Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 25, 2005·45 cites·9 claims
- 0985US7816169B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 19, 2010·5 cites·20 claims
- 1085US6956292B2Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·37 cites·20 claims
- 1183US6583039B2Method of forming a bump on a copper padTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 24, 2003·37 cites·18 claims
- 1282US6649507B1Dual layer photoresist method for fabricating a mushroom bumping plating structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 18, 2003·33 cites·25 claims
- 1378US6936923B2Method to form very a fine pitch solder bump using methods of electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 30, 2005·23 cites·9 claims
- 1476US7485906B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 3, 2009·2 cites·20 claims
- 1575US6372545B1Method for under bump metal patterning of bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 16, 2002·22 cites·35 claims
- 1673US6876049B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 5, 2005·12 cites·20 claims
- 1772US6338976B1Method for forming optoelectronic microelectronic fabrication with attenuated bond pad corrosionTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jan 15, 2002·23 cites·14 claims
- 1870US6765277B2Microelectronic fabrication with corrosion inhibited bond padTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 20, 2004·17 cites·10 claims
- 1962US6426283B1Method for bumping and backlapping a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 30, 2002·10 cites·18 claims
- 2061US6242331B1Method to reduce device contact resistance using a hydrogen peroxide treatmentTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 5, 2001·25 cites·32 claims
- 2153US6468704B1Method for improved photomask alignment after epitaxial process through 90° orientation changeTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 22, 2002·6 cites·16 claims
- 2250US11654529B2Burr trimming deviceIND TECH RES INST·Filed 2020·Granted May 23, 2023·0 cites·9 claims
- 2337US2020206912A1Transmission device and robotic armIND TECH RES INST·Filed 2019·Application pending·0 cites
- 2436US6238983B1Alignment dip back oxide and code implant through poly to approach the depletion mode device characterTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 29, 2001·5 cites·7 claims
- 2533US2020070367A1Load balancing device for robot armIND TECH RES INST·Filed 2018·Application pending·0 cites
- 2632US2006110842A1Method and apparatus for preventing metal/silicon spiking in MEMS devicesCHANG YUH-HWA·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →