Inventor · disambiguated record
Chun-Chieh Chuang
Also filed as: CHUANG CHUN-CHIEH
84 granted patents·8 pending applications·636 citations·filing 2005–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD47TAIWAN SEMICONDUCTOR MFG19CHUANG CHUN-CHIEH8WANG WEN-DE4KAO MIN-FENG3
Top patents by PatentIndex Score
92 records- 0199US11596800B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·6 cites·20 claims
- 0298US9704827B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·32 cites·20 claims
- 0398US8736006B1Backside structure for a BSI image sensor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 27, 2014·31 cites·20 claims
- 0498US8390089B2Image sensor with deep trench isolation structureCHEN SZU-YING·Filed 2010·Granted Mar 5, 2013·53 cites·20 claims
- 0597US9728521B2Hybrid bond using a copper alloy for yield improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·227 cites·20 claims
- 0697US9142586B2Pad design for backside illuminated image sensorWANG WEN-DE·Filed 2010·Granted Sep 22, 2015·37 cites·20 claims
- 0795US11011567B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·3 cites·20 claims
- 0895US8531565B2Front side implanted guard ring structure for backside illuminated image sensorWANG WEN-DE·Filed 2010·Granted Sep 10, 2013·16 cites·20 claims
- 0993US9312294B2Semiconductor devices, methods of manufacturing thereof, and image sensor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 12, 2016·6 cites·20 claims
- 1093US9305966B2Backside structure and method for BSI image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 5, 2016·5 cites·20 claims
- 1193US8709854B2Backside structure and methods for BSI image sensorsCHUANG CHUN-CHIEH·Filed 2012·Granted Apr 29, 2014·14 cites·11 claims
- 1292US9780137B2Mechanisms for forming image-sensor device with epitaxial isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 3, 2017·7 cites·22 claims
- 1392US9666566B13DIC structure and method for hybrid bonding semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·9 cites·20 claims
- 1491US10056353B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 21, 2018·9 cites·20 claims
- 1591US9666630B2Semiconductor devices, methods of manufacturing thereof, and image sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·5 cites·20 claims
- 1691US9287312B2Imaging sensor structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·7 cites·20 claims
- 1791US8981510B2Ridge structure for back side illuminated image sensorCHUANG CHUN-CHIEH·Filed 2010·Granted Mar 17, 2015·7 cites·20 claims
- 1891US2025364494A13DIC Interconnect Apparatus and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1990US11798916B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 24, 2023·5 cites·7 claims
- 2090US9627430B2Method and apparatus for low resistance image sensor contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·3 cites·20 claims
- 2190US8669135B2System and method for fabricating a 3D image sensor structureKAO MIN-FENG·Filed 2012·Granted Mar 11, 2014·6 cites·20 claims
- 2289US9764153B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·7 cites·17 claims
- 2389US9373657B2System and method for fabricating a 3D image sensor structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 21, 2016·4 cites·20 claims
- 2488US9059061B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 16, 2015·3 cites·20 claims
- 2588US8810700B2Front side implanted guard ring structure for backsideTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 19, 2014·4 cites·20 claims
- 2688US8604405B2Backside illuminated image sensor device with refractive index dependent layer thicknesses and method of forming the sameLIU HAN-CHI·Filed 2009·Granted Dec 10, 2013·13 cites·20 claims
- 2788US8405182B2Back side illuminated image sensor with improved stress immunityCHOU KENG-YU·Filed 2011·Granted Mar 26, 2013·12 cites·20 claims
- 2887US11804473B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·1 cites·20 claims
- 2987US10157959B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·3 cites·20 claims
- 3087US8969991B2Backside structure and methods for BSI image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 3, 2015·8 cites·20 claims
- 3187US8614495B2Back side defect reduction for back side illuminated image sensorCHUANG CHUN-CHIEH·Filed 2010·Granted Dec 24, 2013·4 cites·20 claims
- 3286US10290671B2Image sensor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·3 cites·20 claims
- 3386US8227288B2Image sensor and method of fabricating sameWANG WEN-DE·Filed 2009·Granted Jul 24, 2012·7 cites·18 claims
- 3485US10276622B2Mechanisms for forming image-sensor device with expitaxial isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·20 claims
- 3585US9865645B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·3 cites·20 claims
- 3685US8164124B2Photodiode with multi-epi films for image sensorLIU JEN-CHENG·Filed 2007·Granted Apr 24, 2012·9 cites·20 claims
- 3785US7968424B2Method of implantationTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jun 28, 2011·11 cites·20 claims
- 3885US2025359383A1Pixel structures in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3984US12300670B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 4084US10886320B2Mechanisms for forming image-sensor device with epitaxial isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 5, 2021·1 cites·20 claims
- 4184US10535706B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
- 4283US10192918B2Image sensor including dual isolation and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 29, 2019·3 cites·20 claims
- 4383US9245912B2Method and apparatus for low resistance image sensor contactTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 26, 2016·2 cites·20 claims
- 4483US9048162B2CMOS image sensors and methods for forming the sameKAO MIN-FENG·Filed 2012·Granted Jun 2, 2015·2 cites·20 claims
- 4582US10269770B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 4682US9837464B2Backside structure and methods for BSI image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 5, 2017·2 cites·20 claims
- 4782US8569807B2Backside illuminated image sensor having capacitor on pixel regionCHUANG CHUN-CHIEH·Filed 2010·Granted Oct 29, 2013·7 cites·20 claims
- 4882US8222710B2Sensor structure for optical performance enhancementHUNG JHY-MING·Filed 2009·Granted Jul 17, 2012·7 cites·20 claims
- 4981US12476224B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 5081US9525003B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·2 cites·20 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →