Inventor · disambiguated record
Chita Chuang
Also filed as: CHUANG CHITA
50 granted patents·3 pending applications·169 citations·filing 2011–2023
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD33TAIWAN SEMICONDUCTOR MFG11CHUANG CHITA2CHUANG YAO-CHUN2LIU HAO-JUIN2
Top patents by PatentIndex Score
53 records- 0195US9224688B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 29, 2015·17 cites·20 claims
- 0294US9881885B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·11 cites·19 claims
- 0394US9287234B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 15, 2016·10 cites·20 claims
- 0494US9117825B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 25, 2015·12 cites·19 claims
- 0594US8829673B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 9, 2014·17 cites·20 claims
- 0692US10784223B2Elongated bump structures in package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 22, 2020·7 cites·20 claims
- 0790US10290600B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
- 0888US9406629B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·8 cites·12 claims
- 0987US8912649B2Dummy flip chip bumps for reducing stressWU SHENG-YU·Filed 2011·Granted Dec 16, 2014·7 cites·16 claims
- 1086US9711477B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 18, 2017·3 cites·20 claims
- 1186US9397059B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·4 cites·20 claims
- 1286US9257412B2Stress reduction apparatusCHUANG YAO-CHUN·Filed 2012·Granted Feb 9, 2016·6 cites·16 claims
- 1385US9646943B1Connector structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 9, 2017·3 cites·20 claims
- 1485US9472521B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 18, 2016·7 cites·14 claims
- 1583US9741589B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 22, 2017·3 cites·20 claims
- 1683US9673161B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·3 cites·20 claims
- 1782US10515917B2Bump on pad (BOP) bonding structure in semiconductor packaged deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 1880US2024105654A1Method of making semiconductor device and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1979US9905524B2Bump structures in semiconductor device and packaging assemblyCHUANG CHITA·Filed 2011·Granted Feb 27, 2018·4 cites·20 claims
- 2079US9053989B2Elongated bump structure in semiconductor deviceKUO CHEN-CHENG·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
- 2179US9053990B2Bump interconnection techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Jun 9, 2015·5 cites·12 claims
- 2277US9287191B2Semiconductor device package and methodLIU HAO-JUIN·Filed 2011·Granted Mar 15, 2016·5 cites·18 claims
- 2377US9159695B2Elongated bump structures in package structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 13, 2015·3 cites·18 claims
- 2476US10037973B2Method for manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·2 cites·20 claims
- 2576US8659123B2Metal pad structures in diesCHUANG YAO-CHUN·Filed 2011·Granted Feb 25, 2014·4 cites·20 claims
- 2675US11088102B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 2775US8765497B2Packaging and function tests for package-on-package and system-in-package structuresLIU HAO-JUIN·Filed 2011·Granted Jul 1, 2014·3 cites·14 claims
- 2873US9196573B2Bump on pad (BOP) bonding structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 24, 2015·2 cites·19 claims
- 2972US11824026B2Connector structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·20 claims
- 3072US9093332B2Elongated bump structure for semiconductor devicesKUO TIN-HAO·Filed 2011·Granted Jul 28, 2015·3 cites·20 claims
- 3172US8772950B2Methods and apparatus for flip chip substrate with guard rings outside of a die attach regionTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 8, 2014·3 cites·20 claims
- 3271US12113055B2Stress reduction apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 8, 2024·0 cites·20 claims
- 3371US10468366B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 3469US10692848B2Stress reduction apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 23, 2020·1 cites·20 claims
- 3566US9673125B2Interconnection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Jun 6, 2017·2 cites·5 claims
- 3666US9123788B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·1 cites·20 claims
- 3765US11855025B2Semiconductor device and package assembly including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 26, 2023·0 cites·20 claims
- 3865US11631993B2Wireless charging devices having wireless charging coils and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 18, 2023·0 cites·20 claims
- 3964US11244940B2Stress reduction apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
- 4064US10867810B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 4164US10734347B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 4263US10861811B2Connector structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 4358US10748785B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 18, 2020·0 cites·20 claims
- 4458US10388620B2Connector structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 20, 2019·0 cites·19 claims
- 4558US10163839B2Bump on pad (BOP) bonding structure in semiconductor packaged deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 4658US9040350B2Packaging and function tests for package-on-package and system-in-package structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 26, 2015·0 cites·20 claims
- 4756US10483225B2Packaging assembly and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·0 cites·20 claims
- 4855US9748188B2Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·20 claims
- 4955US2019371718A1Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Application pending·0 cites
- 5053US9786621B2Elongated bump structures in package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·0 cites·20 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →