Inventor · disambiguated record
Chee-Key Chung
Also filed as: CHUNG CHEE K · CHUNG CHEE KEY
26 granted patents·7 pending applications·78 citations·filing 2003–2024
94Inventor score
Top patents by PatentIndex Score
33 records- 0196US11676948B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jun 13, 2023·6 cites·11 claims
- 0295US11315881B1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Apr 26, 2022·7 cites·14 claims
- 0392US9754849B2Organic-inorganic hybrid structure for integrated circuit packagesINTEL CORP·Filed 2014·Granted Sep 5, 2017·37 cites·17 claims
- 0489US11482470B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 25, 2022·2 cites·16 claims
- 0585US11056470B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jul 6, 2021·3 cites·11 claims
- 0685US10863626B1Electronic package carrier structure thereof, and method for fabricating the carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Dec 8, 2020·3 cites·12 claims
- 0785US10600708B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Mar 24, 2020·5 cites·8 claims
- 0882US2025046771A1Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0981US10361150B2Substrate construction and electronic package including the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jul 23, 2019·4 cites·30 claims
- 1079US10741500B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Aug 11, 2020·3 cites·17 claims
- 1178US12176327B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 1277US12205906B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·11 claims
- 1377US11069661B1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jul 20, 2021·1 cites·18 claims
- 1473US12100642B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Sep 24, 2024·0 cites·17 claims
- 1568US10950520B2Electronic package, method for fabricating the same, and heat dissipatorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Mar 16, 2021·1 cites·27 claims
- 1666US11792938B2Method for fabricating carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·9 claims
- 1764US11881459B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jan 23, 2024·0 cites·11 claims
- 1861US11289346B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·9 claims
- 1959US11410954B2Electronic package, manufacturing method thereof and conductive structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·16 claims
- 2058US10763237B2Method for manufacturing electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·12 claims
- 2153US10522500B2Method for manufacturing electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·12 claims
- 2252US7701069B2Solder interface locking using unidirectional growth of an intermetallic compoundINTEL CORP·Filed 2003·Granted Apr 20, 2010·6 cites·25 claims
- 2350US9887110B2Substrate warpage control using temper glass with uni-directional heatingINTEL CORP·Filed 2014·Granted Feb 6, 2018·0 cites·20 claims
- 2448US7692301B2Stitched micro-via to enhance adhesion and mechanical strengthINTEL CORP·Filed 2007·Granted Apr 6, 2010·0 cites·7 claims
- 2544US10354891B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Jul 16, 2019·0 cites·18 claims
- 2644US2021280530A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Application pending·0 cites
- 2743US7750450B2Stacked die package with stud spacersINTEL CORP·Filed 2006·Granted Jul 6, 2010·0 cites·11 claims
- 2839US2020043908A1Package stacked structure, method for fabricating the same, and package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 2938US7229913B2Stitched micro-via to enhance adhesion and mechanical strengthINTEL CORP·Filed 2003·Granted Jun 12, 2007·0 cites·20 claims
- 3038US2008079174A1Substrate slot design for die stack packagingPUNZALAN NELSON·Filed 2006·Application pending·0 cites
- 3137US2019057917A1Electronic package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 3235US2005067699A1Diffusion barrier layer for lead free package substrateINTEL CORP·Filed 2003·Application pending·0 cites
- 3333US2007135055A1Combination quad flat no-lead and thin small outline packageHO LEE S·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →