Inventor · disambiguated record
Chao-Tsai Chung
Also filed as: CHUNG CHAO-TSAI
6 granted patents·10 pending applications·64 citations·filing 2002–2021
81Inventor score
Top patents by PatentIndex Score
16 records- 0185US8671570B2Vapor chamber and method for manufacturing the sameLIU JUEI-KHAI·Filed 2010·Granted Mar 18, 2014·15 cites·19 claims
- 0276US6711016B2Side exhaust heat dissipation moduleASUSTEK COMP INC·Filed 2002·Granted Mar 23, 2004·25 cites·18 claims
- 0369US6819564B2Heat dissipation moduleASUSTEK COMP INC·Filed 2002·Granted Nov 16, 2004·18 cites·16 claims
- 0466US8356656B2Heat dissipation device and methodPEGATRON CORP·Filed 2009·Granted Jan 22, 2013·4 cites·15 claims
- 0559US2010059207A1Fin, thermal module, and method for assembling the samePEGATRON CORP·Filed 2009·Application pending·0 cites
- 0659US2010065255A1Vapor ChamberPEGATRON CORP·Filed 2009·Application pending·0 cites
- 0746US2010061052A1Electronic apparatusPEGATRON CORP·Filed 2009·Application pending·0 cites
- 0844US7903420B2Fixing structure of fixing a thermal moduleASUSTEK COMP INC·Filed 2008·Granted Mar 8, 2011·0 cites·7 claims
- 0943US2009052136A1Heat dissipation deviceASUSTEK COMP INC·Filed 2008·Application pending·0 cites
- 1038US2006225282A1Manufacturing method of heat pipeASUSTEK COMP INC·Filed 2006·Application pending·0 cites
- 1137US2021298203A1Automotive electronic deviceASKEY COMPUTER CORP·Filed 2021·Application pending·0 cites
- 1237US2012211203A1Heat Dissipating Apparatus and Method for Improving the SameCHANG YU-WEI·Filed 2012·Application pending·0 cites
- 1337US2007163269A1Heat dissipation moduleASUSTEK COMP INC·Filed 2006·Application pending·0 cites
- 1436US7002804B2Heat dissipating apparatusASUSTEK COMP INC·Filed 2003·Granted Feb 21, 2006·2 cites·15 claims
- 1532US2011108142A1Vapor chamber and manufacturing method thereofLIU JUEI-KHAI·Filed 2010·Application pending·0 cites
- 1626US2010254084A1Motherboard integrated with fanCHEN KUAN-YING·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →