Inventor · disambiguated record
Chin-Lung Chung
Also filed as: CHUNG CHIN-LUNG
9 granted patents·13 pending applications·6 citations·filing 2002–2025
80Inventor score
Top patents by PatentIndex Score
22 records- 0194US11682616B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·3 cites·20 claims
- 0291US11605558B2Integrated circuit interconnect structure having discontinuous barrier layer and air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 14, 2023·2 cites·20 claims
- 0390US12300599B2Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·1 cites·20 claims
- 0480US2025293162A1Integrated chip with graphene based interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0579US12347776B2Integrated chip with graphene based interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0678US11978663B2Integrated circuit interconnect structure having discontinuous barrier layer and air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 7, 2024·0 cites·20 claims
- 0776US2025279351A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0872US2024203789A1Semiconductor structure having vertical conductive graphene and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0969US12218060B2Integrated chip with graphene based interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 1067US11948837B2Semiconductor structure having vertical conductive graphene and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 1165US2022367345A1Hybrid via interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1258US12051643B2Hybrid via interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·20 claims
- 1357US2025132200A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1456US2025300012A1Interconnect structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1556US2025293087A1Semiconductor device including super via and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1654US2025079313A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1752US2024071822A1Low resistance interconnect features and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1851US11114374B2Graphene enabled selective barrier layer formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 1951US2023154791A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2050US2024055352A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2149US2023352409A1Interconnect structure including single layer serving as both barrier layer and liner layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2234US2004120864A1Apparatus for removing acid substances from hot flue gasCHINA STEEL CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →