Inventor · disambiguated record
Chantal Combi
Also filed as: COMBI CHANTAL
18 granted patents·362 citations·filing 2002–2013
95Inventor score
Top patents by PatentIndex Score
18 records- 0195US8049287B2Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated deviceST MICROELECTRONICS SRL·Filed 2008·Granted Nov 1, 2011·50 cites·67 claims
- 0294US8044929B2Analog data-input device provided with a pressure sensor of a microelectromechanical typeST MICROELECTRONICS SRL·Filed 2006·Granted Oct 25, 2011·35 cites·26 claims
- 0394US7875942B2Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA typeST MICROELECTRONICS SRL·Filed 2008·Granted Jan 25, 2011·31 cites·45 claims
- 0494US7322236B2Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring deviceST MICROELECTRONICS SRL·Filed 2006·Granted Jan 29, 2008·39 cites·24 claims
- 0593US7678600B2Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrateST MICROELECTRONICS SRL·Filed 2008·Granted Mar 16, 2010·24 cites·30 claims
- 0692US8847340B2Packaged sensor structure having sensor opening and package opening aligned with sensor elementST MICROELECTRONICS SRL·Filed 2013·Granted Sep 30, 2014·10 cites·19 claims
- 0790US7928960B2Analog input device with integrated pressure sensor and electronic apparatus equipped with said input deviceST MICROELECTRONICS SRL·Filed 2006·Granted Apr 19, 2011·24 cites·34 claims
- 0889US6869856B2Process for manufacturing a semiconductor wafer integrating electronic devices including a structure for electromagnetic decouplingST MICROELECTRONICS SRL·Filed 2002·Granted Mar 22, 2005·78 cites·38 claims
- 0988US8134214B2Electronic device, system, and method comprising differential sensor MEMS devices and drilled substratesBALDO LORENZO·Filed 2009·Granted Mar 13, 2012·14 cites·48 claims
- 1086US7022542B2Manufacturing method of a microelectromechanical switchST MICROELECTRONICS SRL·Filed 2003·Granted Apr 4, 2006·27 cites·10 claims
- 1184US7489004B2Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughnessST MICROELECTRONICS SRL·Filed 2006·Granted Feb 10, 2009·11 cites·19 claims
- 1281USRE46671ESubstrate-level assembly for an integrated device, manufacturing process thereof and related integrated deviceST MICROELECTRONICS SRL·Filed 2013·Granted Jan 16, 2018·5 cites·67 claims
- 1377US8546895B2Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA typeCORTESE MARIO·Filed 2011·Granted Oct 1, 2013·3 cites·46 claims
- 1476US8043881B2Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA typeST MICROELECTRONICS SRL·Filed 2010·Granted Oct 25, 2011·2 cites·21 claims
- 1565US7343805B2Surface acoustic wave pressure sensorST MICROELECTRONICS SRL·Filed 2006·Granted Mar 18, 2008·7 cites·27 claims
- 1653US7421904B2Assembly of an integrated device enabling a facilitated fluidic connection to regions of the deviceST MICROELECTRONICS SRL·Filed 2007·Granted Sep 9, 2008·2 cites·31 claims
- 1751US8796059B2Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposedBALDO LORENZO·Filed 2012·Granted Aug 5, 2014·0 cites·12 claims
- 1846US7242066B2Manufacturing method of a microelectromechanical switchST MICROELECTRONICS SRL·Filed 2006·Granted Jul 10, 2007·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →