Inventor · disambiguated record
Christopher Combs
Also filed as: COMBS CHRISTOPHER · COMBS CHRISTOPHER D · COMBS CHRISTOPHER DAVID
22 granted patents·4 pending applications·343 citations·filing 1995–2024
96Inventor score
Top patents by PatentIndex Score
26 records- 0191US6501658B2Heatsink mounting with shock absorbersINTEL CORP·Filed 2001·Granted Dec 31, 2002·75 cites·17 claims
- 0289USD456249SPlastic package with pull tabINTEL CORP·Filed 2000·Granted Apr 30, 2002·41 cites·1 claims
- 0387US6734371B2Soldered heat sink anchor and method of useINTEL CORP·Filed 2001·Granted May 11, 2004·36 cites·24 claims
- 0478US7183496B2Soldered heat sink anchor and method of useINTEL CORP·Filed 2004·Granted Feb 27, 2007·18 cites·15 claims
- 0573US6801436B2Extension mechanism and method for assembling overhanging componentsINTEL CORP·Filed 2001·Granted Oct 5, 2004·14 cites·11 claims
- 0673US6764325B2Zero insertion force heat-activated retention pinINTEL CORP·Filed 2002·Granted Jul 20, 2004·17 cites·29 claims
- 0770US6700800B2Retainer for circuit board assembly and method for using the sameINTEL CORP·Filed 2002·Granted Mar 2, 2004·15 cites·9 claims
- 0870US6472612B2Printed circuit board with embedded thermocouple junctionsINTEL CORP·Filed 2001·Granted Oct 29, 2002·17 cites·25 claims
- 0968US6791035B2Interposer to couple a microelectronic device package to a circuit boardINTEL CORP·Filed 2002·Granted Sep 14, 2004·11 cites·21 claims
- 1068US2024162134A1Varied ball ball-grid-array (bga) packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 1167US7251880B2Method and structure for identifying lead-free solderINTEL CORP·Filed 2001·Granted Aug 7, 2007·12 cites·29 claims
- 1267US6875931B2Retainer for circuit board assembly and method for using the sameINTEL CORP·Filed 2002·Granted Apr 5, 2005·14 cites·21 claims
- 1367US5671530AFlip-chip mounting assembly and method with vertical wafer feederDELCO ELECTRONICS CORP·Filed 1995·Granted Sep 30, 1997·42 cites·20 claims
- 1458US6651869B2Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave solderingINTEL CORP·Filed 2001·Granted Nov 25, 2003·7 cites·32 claims
- 1555US11916003B2Varied ball ball-grid-array (BGA) packagesINTEL CORP·Filed 2019·Granted Feb 27, 2024·0 cites·22 claims
- 1655US6791189B2Epoxy washer for retention of inverted SMT componentsINTEL CORP·Filed 2002·Granted Sep 14, 2004·5 cites·18 claims
- 1755US6691407B2Methods for retaining assembled componentsINTEL CORP·Filed 2001·Granted Feb 17, 2004·5 cites·14 claims
- 1854US6917524B2Extension mechanism and method for assembling overhanging componentsINTEL CORP·Filed 2004·Granted Jul 12, 2005·4 cites·13 claims
- 1953US7131193B2Heat-shrinkable retainer for PCB double-sided assemblyINTEL CORP·Filed 2004·Granted Nov 7, 2006·3 cites·16 claims
- 2049US10573580B2Surface structure method and apparatus associated with compute or electronic component packagesINTEL CORP·Filed 2017·Granted Feb 25, 2020·0 cites·7 claims
- 2149US6906268B2Heat-shrinkable retainer for PCB double-sided assemblyINTEL CORP·Filed 2001·Granted Jun 14, 2005·2 cites·26 claims
- 2244US6817878B2Zero mounting force solder-free connector/component and methodINTEL CORP·Filed 2001·Granted Nov 16, 2004·3 cites·16 claims
- 2344US6523801B2Component placementINTEL CORP·Filed 2001·Granted Feb 25, 2003·2 cites·35 claims
- 2440US2004003496A1Interposer to couple a microelectronic device package to a circuit boardINTEL CORP·Filed 2003·Application pending·0 cites
- 2534US2004124006A1Built up landsFiled 2002·Application pending·0 cites
- 2631US2019103289A1Techniques to reduce substrate reflow warpageINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →