Inventor · disambiguated record
Chengqiang Cui
Also filed as: CUI CHENGQIANG
5 granted patents·3 pending applications·0 citations·filing 2014–2023
58Inventor score
Top patents by PatentIndex Score
8 records- 0171US12448536B2Nano metal paste, and preparation and application thereofUNIV GUANGDONG TECHNOLOGY·Filed 2023·Granted Oct 21, 2025·0 cites·7 claims
- 0255US10487411B1Method for synchronous electroplating filling of differential vias and electroplating device implementing sameUNIV GUANGDONG TECHNOLOGY·Filed 2019·Granted Nov 26, 2019·0 cites·1 claims
- 0352US2024113068A1Ultrafine-pitch all-copper interconnect structure and forming method thereofUNIV GUANGDONG TECHNOLOGY·Filed 2023·Application pending·0 cites
- 0449US11742316B2Interconnect structure for semiconductor with ultra-fine pitch and forming method thereofUNIV GUANGDONG TECHNOLOGY·Filed 2022·Granted Aug 29, 2023·0 cites·10 claims
- 0547US2021219476A1Variable pitch electronic component mass transfer apparatus and methodUNIV GUANGDONG TECHNOLOGY·Filed 2021·Application pending·0 cites
- 0645US10468265B1Method for synchronous wet etching processing of differential microstructuresUNIV GUANGDONG TECHNOLOGY·Filed 2019·Granted Nov 5, 2019·0 cites·8 claims
- 0742US11212921B2Method for repairing a fine lineUNIV GUANGDONG TECHNOLOGY·Filed 2020·Granted Dec 28, 2021·0 cites·9 claims
- 0840US2016088730A1Package substrate and manufacturing method thereofAKM ELECTRONICS TECHNOLOGY SUZHOU CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →