Inventor · disambiguated record
Cheng Qiang Cui
Also filed as: CUI CHENG Q · CUI CHENG QIANG
9 granted patents·1 pending application·221 citations·filing 1994–2011
89Inventor score
Files withCOMPASS TECHNOLOGY CO LTD3FREESCALE SEMICONDUCTOR INC2INST OF MICROELECTRONICS2UNIV SINGAPORE2NAT UNIVERSITY OF SINGAPORE AN1
Top patents by PatentIndex Score
10 records- 0189US6540866B1Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrateINST OF MICROELECTRONICS·Filed 2000·Granted Apr 1, 2003·49 cites·15 claims
- 0286US6274650B1Epoxy resin compositions for liquid encapsulationINST OF MICROELECTRONICS·Filed 1999·Granted Aug 14, 2001·89 cites·23 claims
- 0385US6537411B1Method for low temperature lamination of metals to polyimidesUNIV SINGAPORE·Filed 2000·Granted Mar 25, 2003·37 cites·14 claims
- 0478US7906844B2Multiple integrated circuit die package with thermal performanceCOMPASS TECHNOLOGY CO LTD·Filed 2006·Granted Mar 15, 2011·8 cites·16 claims
- 0564US7573131B2Die-up integrated circuit package with grounded stiffenerCOMPASS TECHNOLOGY CO LTD·Filed 2006·Granted Aug 11, 2009·5 cites·26 claims
- 0660US8361837B2Multiple integrated circuit die package with thermal performanceCOMPASS TECHNOLOGY CO LTD·Filed 2011·Granted Jan 29, 2013·1 cites·32 claims
- 0754US5451526ADetermination of oxidant or reductant concentration by the spectrophotometric or visual response in oxidation or reduction of polyanilineUNIV SINGAPORE·Filed 1994·Granted Sep 19, 1995·16 cites·14 claims
- 0847US2011059579A1Method of forming tape ball grid array packageFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 0946US7985672B2Solder ball attachment ring and method of useFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jul 26, 2011·0 cites·7 claims
- 1045US6334926B1Method for low temperature lamination of metals to fluoropolymersNAT UNIVERSITY OF SINGAPORE AN·Filed 1999·Granted Jan 1, 2002·16 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →