Inventor · disambiguated record
Christoph Dietz
Also filed as: DIETZ CHRISTOPH
13 granted patents·3 pending applications·116 citations·filing 1998–2022
90Inventor score
Files withPRECITEC OPTRONIK GMBH11DUSEMUND CLAUS1JURCA OPTOELEKTRONIK1KOGEL-HOLLACHER MARKUS1MICHELT BERTHOLD1
Top patents by PatentIndex Score
16 records- 0193US10466357B1Optical measuring devicePRECITEC OPTRONIK GMBH·Filed 2019·Granted Nov 5, 2019·9 cites·12 claims
- 0292US10228551B1Device and method for optically measuring a measurement objectPRECITEC OPTRONIK GMBH·Filed 2018·Granted Mar 12, 2019·23 cites·16 claims
- 0387US8410392B2Machining device and method for machining materialKOGEL-HOLLACHER MARKUS·Filed 2008·Granted Apr 2, 2013·20 cites·6 claims
- 0486US10725178B2Optical measuring devicePRECITEC OPTRONIK GMBH·Filed 2019·Granted Jul 28, 2020·4 cites·13 claims
- 0585US10695863B1Method and device for the controlled machining of a workpiecePRECITEC OPTRONIK GMBH·Filed 2019·Granted Jun 30, 2020·4 cites·22 claims
- 0680US8716039B2Monitoring apparatus and method for in-situ measurement of wafer thicknesses for monitoring the thinning of semiconductor wafers and thinning apparatus comprising a wet etching apparatus and a monitoring apparatusDUSEMUND CLAUS·Filed 2011·Granted May 6, 2014·9 cites·20 claims
- 0774US8699038B2Apparatus and method for monitoring a thickness of a silicon wafer with a highly doped layerSCHOENLEBER MARTIN·Filed 2011·Granted Apr 15, 2014·5 cites·37 claims
- 0870US11460577B2Distance measuring devicePRECITEC OPTRONIK GMBH·Filed 2018·Granted Oct 4, 2022·1 cites·23 claims
- 0969US9230817B2Apparatus and method for monitoring a thickness of a silicon wafer with a highly doped layerPRECITEC OPTRONIK GMBH·Filed 2014·Granted Jan 5, 2016·2 cites·37 claims
- 1068US6084223AMethod of welding workpieces and apparatus for carrying it outJURCA OPTOELEKTRONIK·Filed 1998·Granted Jul 4, 2000·39 cites·15 claims
- 1152US12467733B2Chromatic confocal measuring devicePRECITEC OPTRONIK GMBH·Filed 2021·Granted Nov 11, 2025·0 cites·20 claims
- 1247US11027364B2Method and device for measuring the depth of the vapor capillary during a machining process with a high-energy beamPRECITEC OPTRONIK GMBH·Filed 2016·Granted Jun 8, 2021·0 cites·20 claims
- 1347US2024377186A1Method and device for measuring optical thicknessPRECITEC OPTRONIK GMBH·Filed 2022·Application pending·0 cites
- 1446US2024167808A1Chromatic confocal measuring system for high-speed distance measurementPRECITEC OPTRONIK GMBH·Filed 2022·Application pending·0 cites
- 1538US10762348B2Method and apparatus for determining the position and/or the orientation of an eyePRECITEC OPTRONIK GMBH·Filed 2016·Granted Sep 1, 2020·0 cites·20 claims
- 1635US2007242279A1Device and method for the contactless measurement of at least one curved surfaceMICHELT BERTHOLD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →