Inventor · disambiguated record
Charles W. Eichelberger
Also filed as: ANDREJKO EDWARD S · BUTLER WALTER J · EICHELBERGER CHARLES W · EICHELBERGER CHARLES WILLIAM
131 granted patents·11,613 citations·filing 1975–2009
99Inventor score
Files withGEN ELECTRIC105EPIC TECHNOLOGIES INC12EICHELBERGER CHARLES W7INTEGRATED SYSTEM ASSEMBLIES3INSULATING MATERIALS INC1
Top patents by PatentIndex Score
131 records- 0199US7619901B2Integrated structures and fabrication methods thereof implementing a cell phone or other electronic systemEPIC TECHNOLOGIES INC·Filed 2008·Granted Nov 17, 2009·513 cites·24 claims
- 0299US6555908B1Compliant, solderable input/output bump structuresEPIC TECHNOLOGIES INC·Filed 2000·Granted Apr 29, 2003·215 cites·24 claims
- 0399US5841193ASingle chip modules, repairable multichip modules, and methods of fabrication thereofEPIC TECHNOLOGIES INC·Filed 1996·Granted Nov 24, 1998·811 cites·30 claims
- 0499US5111278AThree-dimensional multichip module systemsEICHELBERGER CHARLES W·Filed 1991·Granted May 5, 1992·565 cites·49 claims
- 0599US4783695AMultichip integrated circuit packaging configuration and methodGEN ELECTRIC·Filed 1986·Granted Nov 8, 1988·516 cites·10 claims
- 0699US4290052ACapacitive touch entry apparatus having high degree of personal safetyGEN ELECTRIC·Filed 1979·Granted Sep 15, 1981·341 cites·8 claims
- 0799US4145748ASelf-optimizing touch pad sensor circuitGEN ELECTRIC·Filed 1977·Granted Mar 20, 1979·128 cites·9 claims
- 0898US8474133B2Method of fabricating a base layer circuit structureEICHELBERGER CHARLES W·Filed 2009·Granted Jul 2, 2013·48 cites·22 claims
- 0998US7863090B2Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic systemEPIC TECHNOLOGIES INC·Filed 2008·Granted Jan 4, 2011·46 cites·10 claims
- 1098US6818544B2Compliant, solderable input/output bump structuresEPIC TECHNOLOGIES INC·Filed 2003·Granted Nov 16, 2004·132 cites·19 claims
- 1198US6159767ASingle chip modules, repairable multichip modules, and methods of fabrication thereofEPIC TECHNOLOGIES INC·Filed 1998·Granted Dec 12, 2000·340 cites·31 claims
- 1298US5250843AMultichip integrated circuit modulesINTEGRATED SYSTEM ASSEMBLIES·Filed 1992·Granted Oct 5, 1993·794 cites·54 claims
- 1398US5241456ACompact high density interconnect structureGEN ELECTRIC·Filed 1990·Granted Aug 31, 1993·466 cites·13 claims
- 1498US4933042AMethod for packaging integrated circuit chips employing a polymer film overlay layerGEN ELECTRIC·Filed 1988·Granted Jun 12, 1990·155 cites·14 claims
- 1598US4918811AMultichip integrated circuit packaging methodGEN ELECTRIC·Filed 1989·Granted Apr 24, 1990·245 cites·5 claims
- 1698US4291303ATouch pad and display tube circuitryGEN ELECTRIC·Filed 1979·Granted Sep 22, 1981·118 cites·52 claims
- 1797US8324020B2Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic systemEICHELBERGER CHARLES W·Filed 2009·Granted Dec 4, 2012·33 cites·17 claims
- 1897US7868445B2Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layerEPIC TECHNOLOGIES INC·Filed 2008·Granted Jan 11, 2011·28 cites·22 claims
- 1997US7830000B2Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic systemEPIC TECHNOLOGIES INC·Filed 2008·Granted Nov 9, 2010·29 cites·16 claims
- 2097US7112467B2Structure and method for temporarily holding integrated circuit chips in accurate alignmentEPIC TECHNOLOGIES INC·Filed 2004·Granted Sep 26, 2006·117 cites·18 claims
- 2197US4894115ALaser beam scanning method for forming via holes in polymer materialsGEN ELECTRIC·Filed 1989·Granted Jan 16, 1990·259 cites·27 claims
- 2297US4835704AAdaptive lithography system to provide high density interconnectGEN ELECTRIC·Filed 1986·Granted May 30, 1989·191 cites·14 claims
- 2397US4167786ALoad control processorGEN ELECTRIC·Filed 1978·Granted Sep 11, 1979·91 cites·11 claims
- 2496US6426545B1Integrated circuit structures and methods employing a low modulus high elongation photodielectricEPIC TECHNOLOGIES INC·Filed 2000·Granted Jul 30, 2002·137 cites·17 claims
- 2596US6396148B1Electroless metal connection structures and methodsEPIC TECHNOLOGIES INC·Filed 2000·Granted May 28, 2002·293 cites·8 claims
- 2696US4780177AExcimer laser patterning of a novel resistGEN ELECTRIC·Filed 1988·Granted Oct 25, 1988·150 cites·34 claims
- 2796US4213182AProgrammable energy load controller system and methodsGEN ELECTRIC·Filed 1978·Granted Jul 15, 1980·162 cites·43 claims
- 2896US4039940ACapacitance sensorGEN ELECTRIC·Filed 1976·Granted Aug 2, 1977·85 cites·13 claims
- 2995US8564119B2Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic systemEICHELBERGER CHARLES W·Filed 2009·Granted Oct 22, 2013·17 cites·20 claims
- 3095US8533941B2Method of bonding two structures together with an adhesive line of controlled thicknessEICHELBERGER CHARLES W·Filed 2009·Granted Sep 17, 2013·16 cites·14 claims
- 3195US5452182AFlexible high density interconnect structure and flexibly interconnected systemMARTIN MARIETTA CORP·Filed 1992·Granted Sep 19, 1995·192 cites·17 claims
- 3295US4487811AElectrical conductorGEN ELECTRIC·Filed 1983·Granted Dec 11, 1984·73 cites·27 claims
- 3395US4425628AControl module for engergy management systemGEN ELECTRIC·Filed 1981·Granted Jan 10, 1984·88 cites·92 claims
- 3494US8590145B2Method of fabricating a circuit structureEICHELBERGER CHARLES W·Filed 2009·Granted Nov 26, 2013·15 cites·13 claims
- 3594US8384199B2Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic systemEPIC TECHNOLOGIES INC·Filed 2008·Granted Feb 26, 2013·16 cites·12 claims
- 3694US8169065B2Stackable circuit structures and methods of fabrication thereofKOHL JAMES E·Filed 2009·Granted May 1, 2012·58 cites·17 claims
- 3793US5144747AApparatus and method for positioning an integrated circuit chip within a multichip moduleINTEGRATED SYSTEM ASSEMBLIES·Filed 1991·Granted Sep 8, 1992·193 cites·26 claims
- 3893US5091769AConfiguration for testing and burn-in of integrated circuit chipsEICHELBERGER CHARLES W·Filed 1991·Granted Feb 25, 1992·163 cites·33 claims
- 3993US5019946AHigh density interconnect with high volumetric efficiencyGEN ELECTRIC·Filed 1988·Granted May 28, 1991·107 cites·22 claims
- 4093US4430557ACooking apparatus having internal pressurizing source and _integral heat source _GEN ELECTRIC·Filed 1982·Granted Feb 7, 1984·68 cites·31 claims
- 4193US4404237AFabrication of electrical conductor by replacement of metallic powder in polymer with more noble metalGEN ELECTRIC·Filed 1980·Granted Sep 13, 1983·67 cites·97 claims
- 4292US5091893AUltrasonic array with a high density of electrical connectionsGEN ELECTRIC·Filed 1990·Granted Feb 25, 1992·127 cites·26 claims
- 4392US4884122AMethod and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layerGEN ELECTRIC·Filed 1988·Granted Nov 28, 1989·103 cites·12 claims
- 4492US4866508AIntegrated circuit packaging configuration for rapid customized design and unique test capabilityGEN ELECTRIC·Filed 1986·Granted Sep 12, 1989·102 cites·17 claims
- 4591US5107586AMethod for interconnecting a stack of integrated circuits at a very high densityGEN ELECTRIC·Filed 1991·Granted Apr 28, 1992·131 cites·18 claims
- 4691US4937203AMethod and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layerGEN ELECTRIC·Filed 1989·Granted Jun 26, 1990·95 cites·14 claims
- 4791US4901136AMulti-chip interconnection packageGEN ELECTRIC·Filed 1988·Granted Feb 13, 1990·99 cites·15 claims
- 4891US4714516AMethod to produce via holes in polymer dielectrics for multiple electronic circuit chip packagingGEN ELECTRIC·Filed 1986·Granted Dec 22, 1987·92 cites·12 claims
- 4991US4646151ATelevision frame synchronizer with independently controllable input/output ratesGEN ELECTRIC·Filed 1985·Granted Feb 24, 1987·85 cites·8 claims
- 5091US4438158AMethod for fabrication of electrical resistorGEN ELECTRIC·Filed 1982·Granted Mar 20, 1984·39 cites·11 claims
Showing the top 50 of 131 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →