Inventor · disambiguated record
Christoffer Erbert
Also filed as: ERBERT CHRISTOFFER
4 granted patents·1 pending application·0 citations·filing 2017–2023
55Inventor score
Top patents by PatentIndex Score
5 records- 0172US12183696B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 31, 2024·0 cites·25 claims
- 0263US11764176B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 19, 2023·0 cites·18 claims
- 0348US2024113053A1Semiconductor device and method of producing thereofINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0445US11195713B2Methods of forming a silicon-insulator layer and semiconductor device having the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 7, 2021·0 cites·15 claims
- 0544US10453806B2Methods for forming semiconductor devices and semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Oct 22, 2019·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →