Inventor · disambiguated record
Che Ming Fang
Also filed as: FANG CHE · FANG CHE MING
5 granted patents·5 pending applications·44 citations·filing 2003–2024
72Inventor score
Top patents by PatentIndex Score
10 records- 0188US11640947B2Pre-resist island forming via method and apparatusNXP BV·Filed 2021·Granted May 2, 2023·2 cites·18 claims
- 0282US7178130B2Digital processing architecture using compiled dataflow definitionNVIDIA CORP·Filed 2003·Granted Feb 13, 2007·42 cites·20 claims
- 0370US2024194486A1Backside and sidewall metallization of semiconductor devicesNXP BV·Filed 2024·Application pending·0 cites
- 0467US11935753B2Backside and sidewall metallization of semiconductor devicesNXP BV·Filed 2021·Granted Mar 19, 2024·0 cites·11 claims
- 0564US12494448B2UBM-free metal skeleton frame with support studs and method for fabrication thereofNXP BV·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 0655US2025212372A1Power supply unit with improved space utilization and heat dissipationPANJIT INT INC·Filed 2024·Application pending·0 cites
- 0754US12198998B2Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging processNXP BV·Filed 2021·Granted Jan 14, 2025·0 cites·19 claims
- 0853US2024355703A1Heat dissipative semiconductor packagePANJIT INT INC·Filed 2023·Application pending·0 cites
- 0952US2025132235A1Semiconductor device with surrounding bump metallization and method thereforNXP USA INC·Filed 2023·Application pending·0 cites
- 1048US2025038138A1Semiconductor device with redistribution layer and method thereforNXP BV·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →