Inventor · disambiguated record
Ching Meng Fang
Also filed as: FANG CHING MENG
8 granted patents·2 pending applications·97 citations·filing 1999–2023
84Inventor score
Files withDELPHI TECH INC3JCET SEMICONDUCTOR SHAOXING CO LTD2STATS CHIPPAC PTE LTD2AGERE SYST GUARDIAN CORP1MANDEL LARRY M1
Top patents by PatentIndex Score
10 records- 0193US7616448B2Wrap-around overmold for electronic assemblyDELPHI TECH INC·Filed 2007·Granted Nov 10, 2009·43 cites·7 claims
- 0288US7455552B1Overmolded electronic assembly with metal seal ringDELPHI TECH INC·Filed 2008·Granted Nov 25, 2008·22 cites·7 claims
- 0372US12469791B2Semiconductor device and method of stacking hybrid substrates with embedded electric componentsSTATS CHIPPAC PTE LTD·Filed 2022·Granted Nov 11, 2025·0 cites·21 claims
- 0468US12148677B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 0561US9627338B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageSTATS CHIPPAC LTD·Filed 2014·Granted Apr 18, 2017·1 cites·24 claims
- 0658US6319450B1Encapsulated circuit using vented moldAGERE SYST GUARDIAN CORP·Filed 1999·Granted Nov 20, 2001·26 cites·4 claims
- 0757US2024379479A1Semiconductor Device and Method of Making a Fan-Out Semiconductor Package with Pre-Assembled Passive ModulesSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0853US7462077B2Overmolded electronic assemblyDELPHI TECH INC·Filed 2006·Granted Dec 9, 2008·5 cites·7 claims
- 0950US11227809B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jan 18, 2022·0 cites·25 claims
- 1035US2009197478A1Interlocking overmold for electronic assemblyMANDEL LARRY M·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →