Inventor · disambiguated record
Chee Seng Foong
Also filed as: FOONG CHEE S · FOONG CHEE SENG
37 granted patents·15 pending applications·251 citations·filing 2001–2023
96Inventor score
Files withFOONG CHEE SENG15FREESCALE SEMICONDUCTOR INC11NXP USA INC11FOONG CHEE S2KALANDAR NAVAS KHAN ORATTI2
Top patents by PatentIndex Score
52 records- 0197US7285855B2Packaged device and method of forming sameFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Oct 23, 2007·86 cites·10 claims
- 0294US9935079B1Laser sintered interconnections between dieNXP USA INC·Filed 2016·Granted Apr 3, 2018·16 cites·13 claims
- 0386US8860212B1Fluid cooled semiconductor die packageFOONG CHEE SENG·Filed 2013·Granted Oct 14, 2014·9 cites·18 claims
- 0485US7452750B2Capacitor attachment methodFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 18, 2008·13 cites·20 claims
- 0584US7554185B2Flip chip and wire bond semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jun 30, 2009·21 cites·9 claims
- 0684US6900531B2Image sensor deviceFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted May 31, 2005·53 cites·16 claims
- 0782US10722947B2Micro-selective sintering laser systems and methods thereofUNIV TEXAS·Filed 2017·Granted Jul 28, 2020·2 cites·31 claims
- 0880US9202770B1Non-homogeneous molding of packaged semiconductor devicesFOONG CHEE SENG·Filed 2014·Granted Dec 1, 2015·5 cites·9 claims
- 0979US9209147B1Method of forming pillar bumpFOONG CHEE SENG·Filed 2014·Granted Dec 8, 2015·6 cites·13 claims
- 1076US12341089B2Device package substrate structure and method thereforNXP USA INC·Filed 2023·Granted Jun 24, 2025·0 cites·18 claims
- 1176US9269659B1Interposer with overmolded viasFOONG CHEE SENG·Filed 2015·Granted Feb 23, 2016·2 cites·18 claims
- 1272US8643172B2Heat spreader for center gate moldingFOONG CHEE SENG·Filed 2007·Granted Feb 4, 2014·6 cites·5 claims
- 1371US9040335B2Side vented pressure sensor deviceBOON YEW LOW·Filed 2013·Granted May 26, 2015·6 cites·14 claims
- 1471US7432130B2Method of packaging semiconductor die without lead frame or substrateFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 7, 2008·6 cites·12 claims
- 1570US8049313B2Heat spreader for semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 1, 2011·8 cites·7 claims
- 1668US7179682B2Packaged device and method of forming sameFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Feb 20, 2007·4 cites·19 claims
- 1766US8415779B2Lead frame for semiconductor packageWONG TZU LING·Filed 2011·Granted Apr 9, 2013·3 cites·18 claims
- 1865US10537019B1Substrate dielectric crack prevention using interleaved metal planeNXP USA INC·Filed 2019·Granted Jan 14, 2020·1 cites·16 claims
- 1964US11798871B2Device package substrate structure and method thereforNXP USA INC·Filed 2020·Granted Oct 24, 2023·0 cites·19 claims
- 2063US11189557B2Hybrid packageNXP USA INC·Filed 2020·Granted Nov 30, 2021·0 cites·6 claims
- 2161US9997445B2Substrate interconnections for packaged semiconductor deviceNXP USA INC·Filed 2016·Granted Jun 12, 2018·1 cites·8 claims
- 2260US9437492B2Substrate for alternative semiconductor die configurationsYOW KAI YUN·Filed 2014·Granted Sep 6, 2016·1 cites·8 claims
- 2357US2025038092A1Semiconductor device with hybrid routing and method thereforNXP USA INC·Filed 2023·Application pending·0 cites
- 2454US7566648B2Method of making solder padFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jul 28, 2009·1 cites·14 claims
- 2552US9134193B2Stacked die sensor packageFOONG CHEE SENG·Filed 2013·Granted Sep 15, 2015·1 cites·15 claims
- 2651US9474162B2Circuit substrate and method of manufacturing sameFOONG CHEE SENG·Filed 2014·Granted Oct 18, 2016·0 cites·10 claims
- 2750US2015342069A1Housing for electronic devicesFOONG CHEE SENG·Filed 2014·Application pending·0 cites
- 2849US9053972B1Pillar bump formed using spot-laserFOONG CHEE SENG·Filed 2013·Granted Jun 9, 2015·0 cites·9 claims
- 2949US2020013711A1Hybrid packageNXP USA INC·Filed 2018·Application pending·0 cites
- 3048US11018024B2Method of fabricating embedded tracesNXP USA INC·Filed 2018·Granted May 25, 2021·0 cites·20 claims
- 3148US2023137977A1Stacking a semiconductor die and chip-scale-package unitNXP BV·Filed 2021·Application pending·0 cites
- 3246US11908784B2Packaged semiconductor device assemblyNXP USA INC·Filed 2020·Granted Feb 20, 2024·0 cites·20 claims
- 3346US9401345B2Semiconductor device package with organic interposerFOONG CHEE SENG·Filed 2014·Granted Jul 26, 2016·0 cites·14 claims
- 3446US2015183131A1Semiconductor wafer dicing bladeFOONG CHEE SENG·Filed 2013·Application pending·0 cites
- 3545US11270972B2Package with conductive underfill ground planeNXP USA INC·Filed 2019·Granted Mar 8, 2022·0 cites·14 claims
- 3645US9209120B2Semiconductor package with lead mounted power barTIU KONG BEE·Filed 2014·Granted Dec 8, 2015·0 cites·14 claims
- 3745US2016163671A1Integrated circuit package with power platesKUMAR SHAILESH·Filed 2014·Application pending·0 cites
- 3843US9287236B2Flexible packaged integrated circuitLAU TECK BENG·Filed 2014·Granted Mar 15, 2016·0 cites·18 claims
- 3943US9177834B2Power bar design for lead frame-based packagesFOONG CHEE SENG·Filed 2014·Granted Nov 3, 2015·0 cites·8 claims
- 4043US9159682B2Copper pillar bump and flip chip package using sameFOONG CHEE SENG·Filed 2013·Granted Oct 13, 2015·0 cites·9 claims
- 4143US2015200177A1Wafer level package with redistribution layer formed with metallic powderFOONG CHEE SENG·Filed 2014·Application pending·0 cites
- 4242US9978669B2Packaged semiconductor device having a lead frame and inner and outer leads and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted May 22, 2018·0 cites·10 claims
- 4342US2015311143A1Lead frames having metal traces with metal stubsFOONG CHEE SENG·Filed 2014·Application pending·0 cites
- 4442US2015054099A1Pressure sensor device and assembly methodYOW KAI YUN·Filed 2013·Application pending·0 cites
- 4541US2007122943A1Method of making semiconductor package having exposed heat spreaderFOONG CHEE S·Filed 2005·Application pending·0 cites
- 4640US2014231977A1Semiconductor packages with low stand-off interconnections between chipsKALANDAR NAVAS KHAN ORATTI·Filed 2013·Application pending·0 cites
- 4738US8810020B2Semiconductor device with redistributed contactsKALANDAR NAVAS KHAN ORATTI·Filed 2012·Granted Aug 19, 2014·0 cites·7 claims
- 4834US9698093B2Universal BGA substrateFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jul 4, 2017·0 cites·9 claims
- 4933US2004065933A1Flip chip optical and imaging sensor deviceFiled 2002·Application pending·0 cites
- 5033US2006012055A1Semiconductor package including rivet for bonding of lead postsFOONG CHEE S·Filed 2004·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →