Inventor · disambiguated record
Chieh-Chen Fu
Also filed as: FU CHIEH-CHEN
10 granted patents·4 pending applications·76 citations·filing 2008–2025
87Inventor score
Top patents by PatentIndex Score
14 records- 0195US9269673B1Semiconductor device packagesADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Feb 23, 2016·43 cites·20 claims
- 0290US9871005B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jan 16, 2018·8 cites·22 claims
- 0386US10784208B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 22, 2020·6 cites·19 claims
- 0482US12266644B2Semiconductor package device method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 1, 2025·1 cites·20 claims
- 0578US8963316B2Semiconductor device and method for manufacturing the sameHSU CHIH-JING·Filed 2012·Granted Feb 24, 2015·11 cites·16 claims
- 0676US10431554B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 1, 2019·2 cites·19 claims
- 0775US2025259978A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0870US8120148B2Package structure with embedded die and method of fabricating the sameCHEN KUO-HUA·Filed 2008·Granted Feb 21, 2012·5 cites·20 claims
- 0957US10930627B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 23, 2021·0 cites·23 claims
- 1052US11474301B2Device for communicationADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 18, 2022·0 cites·10 claims
- 1152US11329016B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 1247US2010006330A1Structure and process of embedded chip packageADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 1347US2024213205A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1435US2011127654A1Semiconductor Package and Manufacturing Methods ThereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →