Inventor · disambiguated record
Chih-Chieh Fu
Also filed as: FU CHIH-CHIEH
13 granted patents·4 pending applications·40 citations·filing 2007–2025
85Inventor score
Files withHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD14TAIWAN SEMICONDUCTOR MFG CO LTD2FU CHIH-CHIEH1
Top patents by PatentIndex Score
17 records- 0188US8190377B2Enhanced rail inspectionFU CHIH-CHIEH·Filed 2007·Granted May 29, 2012·33 cites·22 claims
- 0280US10561017B1Circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Feb 11, 2020·3 cites·13 claims
- 0379US11044813B2All-directions embeded module, method for manufacturing the all-directions embeded module, and all-directions packaging structureHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Jun 22, 2021·2 cites·7 claims
- 0474US10757817B2Printed circuit board with embedded components for electronic device and method for making the sameHONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD·Filed 2019·Granted Aug 25, 2020·1 cites·6 claims
- 0568US11483931B2All-directions embeded module, method for manufacturing the all-directions embeded module, and all-directions packaging structureHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2021·Granted Oct 25, 2022·0 cites·11 claims
- 0666US11399436B2Circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·6 claims
- 0766US11289468B2Package structure and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Mar 29, 2022·1 cites·17 claims
- 0863US2025149360A1Semiconductor storage apparatus with integrated sorterTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0958US12198956B2Semiconductor storage apparatus with integrated sorterTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 14, 2025·0 cites·20 claims
- 1057US10827623B2Method of making a circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Nov 3, 2020·0 cites·7 claims
- 1153US2024098908A1Circuit board connection structure and preparation method thereforHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Application pending·0 cites
- 1251US2022279655A1Packaging structureHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2022·Application pending·0 cites
- 1348US10993328B2Module-embedded multilayer circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Apr 27, 2021·0 cites·17 claims
- 1447US11864329B2Packaging structure with embedded electronic components and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·13 claims
- 1547US10729017B2Circuit board and method of making sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Jul 28, 2020·0 cites·10 claims
- 1644US11375619B2Method for manufacturing a packaging structureHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Jun 28, 2022·0 cites·7 claims
- 1735US2024006748A1Circuit board and manufacturing method thereofHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →