Inventor · disambiguated record
Chong Leong Gan
Also filed as: GAN CHONG LEONG
3 granted patents·9 pending applications·0 citations·filing 2020–2025
42Inventor score
Files withMICRON TECHNOLOGY INC12
Top patents by PatentIndex Score
12 records- 0160US2025294687A1Chemical shielding structure for immersion coolingMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0260US2025294702A1Thermally-enhanced structure for immersion coolingMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0356US2025096046A1Structure for testing interfacial adhesion between mold compound and vertical edges of a semiconductor dieMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0454US12424565B2Radiation protection for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 23, 2025·0 cites·18 claims
- 0554US12218103B2Radiation hardened semiconductor devices and packagingMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 0654US2024347413A1Thermally regulated semiconductor deviceMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0752US2024347478A1Substrate alpha particle shield for semiconductor packagesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 0847US2024071977A1Die edge fillet and 3d-printed cnt as bending stress bufferMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0945US2024194549A1Semiconductor device assemblies with an encapsulant material having enhanced thermal conductivity, and methods for making the sameMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1044US2025309022A1Annular stress reduction structure for semiconductor substrateMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1140US11515222B2Semiconductor assemblies with flow controller to mitigate ingression of mold materialMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 29, 2022·0 cites·13 claims
- 1236US2025246508A1Semiconductor package with embedded skeletal heat transfer structureMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →