Inventor · disambiguated record
Christian Geissler
Also filed as: GEISSLER CHRISTIAN · GEISSLER CHRISTIAN GEORG
53 granted patents·13 pending applications·184 citations·filing 2006–2024
97Inventor score
Top patents by PatentIndex Score
66 records- 0197US11955462B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 0297US9997444B2Microelectronic package having a passive microelectronic device disposed within a package bodyINTEL CORP·Filed 2014·Granted Jun 12, 2018·41 cites·24 claims
- 0397US9663353B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2013·Granted May 30, 2017·29 cites·16 claims
- 0494US12158448B2Radiation source deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 3, 2024·2 cites·20 claims
- 0594US8080858B2Semiconductor component having a space saving edge structureHIRLER FRANZ·Filed 2007·Granted Dec 20, 2011·32 cites·11 claims
- 0689US10403609B2System-in-package devices and methods for forming system-in-package devicesINTEL IP CORP·Filed 2015·Granted Sep 3, 2019·7 cites·25 claims
- 0788US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0887US10115668B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2015·Granted Oct 30, 2018·5 cites·10 claims
- 0985US9252251B2Semiconductor component with a space saving edge structureHIRLER FRANZ·Filed 2011·Granted Feb 2, 2016·7 cites·23 claims
- 1084US12040543B2Radio-frequency devices and methods for producing radio-frequency devicesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 16, 2024·1 cites·20 claims
- 1184US10899604B2Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 26, 2021·3 cites·10 claims
- 1281US10209466B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2016·Granted Feb 19, 2019·3 cites·17 claims
- 1381US9741651B1Redistribution layer linesINTEL IP CORP·Filed 2016·Granted Aug 22, 2017·3 cites·18 claims
- 1481US2024213225A1Package stacking using chip to wafer bondingINTEL CORP·Filed 2024·Application pending·0 cites
- 1581US2025060338A1Radiation source deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1680US9856136B2Chip arrangement and method for manufacturing a chip arrangementINTEL MOBILE COMM GMBH·Filed 2013·Granted Jan 2, 2018·5 cites·34 claims
- 1779US10553538B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2018·Granted Feb 4, 2020·2 cites·19 claims
- 1879US10522485B2Electrical device and a method for forming an electrical deviceINTEL IP CORP·Filed 2015·Granted Dec 31, 2019·3 cites·25 claims
- 1979US8786105B1Semiconductor device with chip having low-k-layersMEYER THORSTEN·Filed 2013·Granted Jul 22, 2014·5 cites·30 claims
- 2078US11239199B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2015·Granted Feb 1, 2022·2 cites·18 claims
- 2178US9056763B2Stress buffer layer for integrated microelectromechanical systems (MEMS)GEISSLER CHRISTIAN·Filed 2013·Granted Jun 16, 2015·5 cites·35 claims
- 2276US9550670B2Stress buffer layer for integrated microelectromechanical systems (MEMS)INTEL IP CORP·Filed 2015·Granted Jan 24, 2017·2 cites·22 claims
- 2374US10741486B2Electronic components having three-dimensional capacitors in a metallization stackINTEL IP CORP·Filed 2016·Granted Aug 11, 2020·2 cites·25 claims
- 2473US9397019B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2014·Granted Jul 19, 2016·2 cites·14 claims
- 2572US9472515B2Integrated circuit packageINTEL CORP·Filed 2014·Granted Oct 18, 2016·2 cites·13 claims
- 2669US10672731B2Wafer level package structure with internal conductive layerINTEL IP CORP·Filed 2015·Granted Jun 2, 2020·1 cites·18 claims
- 2769US7433232B2Memory transistor and memory unit with asymmetrical pocket doping regionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 7, 2008·7 cites·35 claims
- 2867US11505450B2Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 22, 2022·0 cites·9 claims
- 2965US11424209B2Wafer level package structure with internal conductive layerINTEL CORP·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 3065US10490527B2Vertical wire connections for integrated circuit packageINTEL IP CORP·Filed 2015·Granted Nov 26, 2019·1 cites·22 claims
- 3164US10651102B2Interposer with conductive routing exposed on sidewallsINTEL IP CORP·Filed 2015·Granted May 12, 2020·1 cites·11 claims
- 3263US10442457B2Steering column having an adaptable pivot supportTHYSSENKRUPP PRESTA AG·Filed 2015·Granted Oct 15, 2019·2 cites·11 claims
- 3361US8598709B2Method and system for routing electrical connections of semiconductor chipsMEYER THORSTEN·Filed 2010·Granted Dec 3, 2013·1 cites·24 claims
- 3460US2024196757A1Fan-out wafer-level packages and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3559US2025189604A1Sensor devices and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3658US10816742B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2018·Granted Oct 27, 2020·0 cites·8 claims
- 3758US10793429B2Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assemblyINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 6, 2020·0 cites·20 claims
- 3858US10301176B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2017·Granted May 28, 2019·0 cites·29 claims
- 3957US10584028B2Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assemblyINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 10, 2020·0 cites·12 claims
- 4057US10150668B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2017·Granted Dec 11, 2018·0 cites·20 claims
- 4156US10522454B2Microelectronic package having a passive microelectronic device disposed within a package bodyINTEL CORP·Filed 2018·Granted Dec 31, 2019·0 cites·12 claims
- 4254US10373844B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2017·Granted Aug 6, 2019·0 cites·4 claims
- 4354US9653324B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2016·Granted May 16, 2017·0 cites·7 claims
- 4452US10157869B2Integrated circuit packageINTEL CORP·Filed 2016·Granted Dec 18, 2018·0 cites·10 claims
- 4551US10427706B2Steering column with a bearing seat which can be mounted in a flexible mannerTHYSSENKRUPP PRESTA AG·Filed 2015·Granted Oct 1, 2019·1 cites·11 claims
- 4649US10228725B2Flexible band wearable electronic deviceINTEL IP CORP·Filed 2016·Granted Mar 12, 2019·0 cites·18 claims
- 4749US9627520B2MOS transistor having a cell array edge zone arranged partially below and having an interface with a trench in an edge region of the cell arrayINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Apr 18, 2017·0 cites·29 claims
- 4849US2017278778A1Microelectronic interconnect adaptorINTEL CORP·Filed 2017·Application pending·0 cites
- 4949US2018068939A1Redistribution layer linesINTEL IP CORP·Filed 2017·Application pending·0 cites
- 5048US11145563B2Semiconductor devices having cutouts in an encapsulation material and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 12, 2021·0 cites·25 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Christian Geissler files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →