Inventor · disambiguated record

Christopher Glancey

Also filed as: GLANCEY CHRISTOPHER

13 granted patents·10 pending applications·4 citations·filing 2019–2024

83Inventor score

Technology areasH10W H05K F16F

Files withMICRON TECHNOLOGY INC23

Top patents by PatentIndex Score

23 records

0193US11276659B2Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elementsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 15, 2022·4 cites·15 claims
0274US12211814B2Semiconductor interconnect structures with conductive elements, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·21 claims
0373US12211822B2Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
0473US2025079371A1Semiconductor die assemblies with flexible interconnects and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
0572US12218079B2Semiconductor devices with reinforced substratesMICRON TECHNOLOGY INC·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
0669US11869862B2Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 9, 2024·0 cites·17 claims
0767US11552029B2Semiconductor devices with reinforced substratesMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 10, 2023·0 cites·11 claims
0865US11728307B2Semiconductor interconnect structures with conductive elements, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 15, 2023·0 cites·21 claims
0965US11664360B2Circuit board with spaces for embedding componentsMICRON TECHNOLOGY INC·Filed 2021·Granted May 30, 2023·0 cites·11 claims
1064US11855002B2Warpage control in microelectronic packages, and related assemblies and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
1161US11769752B2Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 26, 2023·0 cites·20 claims
1261US2023260943A1Semiconductor die assemblies with flexible interconnects and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
1360US2024355748A1High-performance semiconductor fan out packageMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
1458US2024339496A1Semiconductor dies with rounded or chamfered edgesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
1557US11031353B2Warpage control in microelectronic packages, and related assemblies and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 8, 2021·0 cites·26 claims
1657US2024145337A1Semiconductor device assembly with a thermally-conductive channelMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
1757US2025014959A1Microelectronic devices including recesses in an encapsulant material and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
1856US2022085002A1Circuit board with spaces for embedding componentsMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
1956US2024407080A1Printed circuit board with enhanced structural supportMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
2055US2024292522A1Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
2154US12341110B2Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 24, 2025·0 cites·14 claims
2247US11646286B2Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder jointsMICRON TECHNOLOGY INC·Filed 2019·Granted May 9, 2023·0 cites·10 claims
2346US2024117855A1A damper for a printed circuit board assemblyMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Christopher Glancey files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →