Inventor · disambiguated record
Christian Göbl
Also filed as: GOBL CHRISTIAN · GOEBL CHRISTIAN · GÖBL CHRISTIAN
16 granted patents·3 pending applications·107 citations·filing 1992–2023
91Inventor score
Files withSEMIKRON ELEKTRONIK GMBH9SEMIKRON ELEKTRONIK GMBH & CO KG8EXPORT CONTOR AUSSENHANDEL1GÖBL CHRISTIAN1
Top patents by PatentIndex Score
19 records- 0186US9883596B2Method for producing a switching device with a moisture-tight and electrically insulating cover and for producing an arrangement therewithSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2015·Granted Jan 30, 2018·6 cites·22 claims
- 0283US9627343B2Power semiconductor module with switching device and assemblySEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2015·Granted Apr 18, 2017·7 cites·21 claims
- 0383US7042074B2Power semiconductor module and method for producing itSEMIKRON ELEKTRONIK GMBH·Filed 2004·Granted May 9, 2006·38 cites·2 claims
- 0479US7626256B2Compact power semiconductor module having a connecting deviceSEMIKRON ELEKTRONIK GMBH·Filed 2007·Granted Dec 1, 2009·11 cites·13 claims
- 0575US6979204B2Pressure piece for use in a power semiconductor moduleSEMIKRON ELEKTRONIK GMBH·Filed 2004·Granted Dec 27, 2005·23 cites·7 claims
- 0665US7884287B2Connecting device for electronic componentsSEMIKRON ELEKTRONIK GMBH·Filed 2007·Granted Feb 8, 2011·4 cites·18 claims
- 0764US10002812B2Power semiconductor module having a pressure application body and arrangement therewithSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2017·Granted Jun 19, 2018·2 cites·20 claims
- 0860US9530712B2Power electronic switching device and assemblySEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2014·Granted Dec 27, 2016·1 cites·19 claims
- 0956US7723244B2Method for internal electrical insulation of a substrate for a power semiconductor moduleSEMIKRON ELEKTRONIK GMBH·Filed 2005·Granted May 25, 2010·2 cites·6 claims
- 1056US2023360988A1Potted electronic circuitSEMIKRON ELEKTRONIK GMBH &CO KG·Filed 2023·Application pending·0 cites
- 1155US9392714B2Power semiconductor module and method of manufacturing a power semiconductorSEMIKRON ELEKTRONIK GMBH·Filed 2014·Granted Jul 12, 2016·1 cites·10 claims
- 1250US6654249B2Circuit arrangementSEMIKRON ELEKTRONIK GMBH·Filed 2002·Granted Nov 25, 2003·6 cites·16 claims
- 1342US10603741B2Apparatus for the material-bonded connection of connection partners of a power-electronics componentSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2016·Granted Mar 31, 2020·0 cites·17 claims
- 1441US9768036B2Power semiconductor substrates with metal contact layer and method of manufacture thereofGÖBL CHRISTIAN·Filed 2008·Granted Sep 19, 2017·0 cites·10 claims
- 1541US2008292874A1Sintered power semiconductor substrate and method of producing the substrateSEMIKRON ELEKTRONIK GMBH·Filed 2008·Application pending·0 cites
- 1640US2007131353A1Apparatus and clocked method for pressure-sintered bondingSEMIKRON ELEKTRONIK GMBH·Filed 2006·Application pending·0 cites
- 1735US10312380B2Semiconductor diode and electronic circuit arrangement herewithSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2018·Granted Jun 4, 2019·0 cites·14 claims
- 1831US10134608B2Power electronic switching device and power semiconductor module therewithSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2017·Granted Nov 20, 2018·0 cites·9 claims
- 1928US5357401AElectronic circuit arrangementEXPORT CONTOR AUSSENHANDEL·Filed 1992·Granted Oct 18, 1994·6 cites·37 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →