Inventor · disambiguated record
Chengyu Guo
Also filed as: GUO CHENGYU
4 granted patents·3 pending applications·47 citations·filing 2002–2023
73Inventor score
Files withLSI LOGIC CORP3INST OF INFORMATION ENGINEERING CHINESE ACADEMY OF SCIENCES1LSI CORP1LSI LOGIC CORP A DELAWARE CORP1PETROCHINA CO LTD1
Top patents by PatentIndex Score
7 records- 0178US6897555B1Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit dieLSI LOGIC CORP·Filed 2003·Granted May 24, 2005·32 cites·26 claims
- 0267US8350379B2Package with power and ground through viaLSI CORP·Filed 2008·Granted Jan 8, 2013·4 cites·10 claims
- 0361US2025262612A1Solid acid alkylation catalyst, and preparation method therefor and use thereofPETROCHINA CO LTD·Filed 2022·Application pending·0 cites
- 0460US6687133B1Ground plane on 2 layer PBGALSI LOGIC CORP·Filed 2002·Granted Feb 3, 2004·11 cites·3 claims
- 0548US2025036541A1Method for health evaluation based on intelligent operation and maintenance scenarios, and device thereofINST OF INFORMATION ENGINEERING CHINESE ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0641US7325216B2Method and computer program for spreading trace segments in an integrated circuit package designLSI LOGIC CORP·Filed 2005·Granted Jan 29, 2008·0 cites·14 claims
- 0734US2006043587A1Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packagesLSI LOGIC CORP A DELAWARE CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →