Inventor · disambiguated record
Charles C. Haluzak
Also filed as: HALUZAK CHARLES · HALUZAK CHARLES C · HALUZAK CHARLES CRAIG
65 granted patents·11 pending applications·781 citations·filing 1990–2023
99Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO42MATTHEWS INT CORP10HEWLETT PACKARD CO7CHEN CHIEN-HUA3FOLKERS JOHN P2
Top patents by PatentIndex Score
76 records- 0196US7828417B2Microfluidic device and a fluid ejection device incorporating the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Nov 9, 2010·22 cites·23 claims
- 0294US7417307B2System and method for direct-bonding of substratesHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Aug 26, 2008·36 cites·11 claims
- 0392US6398348B1Printing structure with insulator layerHEWLETT PACKARD CO·Filed 2000·Granted Jun 4, 2002·45 cites·17 claims
- 0491US7393712B2Fluidic MEMS deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Jul 1, 2008·25 cites·15 claims
- 0591US7378030B2Flextensional transducer and method of forming flextensional transducerHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted May 27, 2008·12 cites·30 claims
- 0691US6312103B1Self-cleaning titanium dioxide coated ink-jet printer headHEWLETT PACKARD CO·Filed 1998·Granted Nov 6, 2001·78 cites·17 claims
- 0790US6878638B2Multi-level integrated circuit for wide-gap substrate bondingHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Apr 12, 2005·52 cites·16 claims
- 0890US6627467B2Fluid ejection device fabricationHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Sep 30, 2003·36 cites·23 claims
- 0989US10994535B2Systems and methods for controlling operation of micro-valves for use in jetting assembliesMATTHEWS INT CORP·Filed 2019·Granted May 4, 2021·2 cites·18 claims
- 1089US6685302B2Flextensional transducer and method of forming a flextensional transducerHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Feb 3, 2004·35 cites·35 claims
- 1187US11186084B2Electrode structures for micro-valves for use in jetting assembliesMATTHEWS INT CORP·Filed 2019·Granted Nov 30, 2021·2 cites·19 claims
- 1287US7490924B2Drop generator for ultra-small dropletsHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Feb 17, 2009·38 cites·16 claims
- 1387US7307773B2Micro-optoelectromechanical system packages for a light modulator and methods of making the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Dec 11, 2007·10 cites·62 claims
- 1487US6502918B1Feature in firing chamber of fluid ejection deviceHEWLETT PACKARD CO·Filed 2001·Granted Jan 7, 2003·25 cites·9 claims
- 1587US6204182B1In-situ fluid jet orificeHEWLETT PACKARD CO·Filed 1998·Granted Mar 20, 2001·55 cites·42 claims
- 1686US6315397B2In-situ fluid jet orificeHEWLETT PACKARD CO·Filed 2000·Granted Nov 13, 2001·25 cites·10 claims
- 1785US6698868B2Thermal drop generator for ultra-small dropletsHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Mar 2, 2004·27 cites·9 claims
- 1884US7766462B2Method for forming a fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 3, 2010·6 cites·21 claims
- 1984US6946728B2System and methods for hermetic sealing of post media-filled MEMS packageHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Sep 20, 2005·28 cites·18 claims
- 2083US11975539B2Systems and methods for controlling operation of micro-valves for use in jetting assembliesMATTHEWS INT CORP·Filed 2023·Granted May 7, 2024·0 cites·18 claims
- 2182US7780830B2Electro-wetting on dielectric for pin-style fluid deliveryHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Aug 24, 2010·10 cites·21 claims
- 2279US11479041B2Systems and methods for sealing micro-valves for use in jetting assembliesMATTHEWS INT CORP·Filed 2019·Granted Oct 25, 2022·2 cites·13 claims
- 2379US6938340B2Method of forming a printhead using a silicon on insulator substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Sep 6, 2005·18 cites·6 claims
- 2478US8007078B2Microfluidic device and a fluid ejection device incorporating the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2010·Granted Aug 30, 2011·2 cites·20 claims
- 2578US7443017B2Package having bond-sealed underbumpHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Oct 28, 2008·5 cites·17 claims
- 2677US11938733B2Systems and methods for sealing micro-valves for use in jetting assembliesMATTHEWS INT CORP·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
- 2777US8454149B2Thermal inkjet print head with solvent resistanceLAMBRIGHT TERRY M·Filed 2010·Granted Jun 4, 2013·3 cites·21 claims
- 2877US6686642B2Multi-level integrated circuit for wide-gap substrate bondingHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Feb 3, 2004·22 cites·17 claims
- 2976US7549225B2Method of forming a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Jun 23, 2009·3 cites·17 claims
- 3075US11660861B2Systems and methods for controlling operation of micro-valves for use in jetting assembliesMATTHEWS INT CORP·Filed 2021·Granted May 30, 2023·0 cites·15 claims
- 3175US7288464B2MEMS packaging structure and methodsHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Oct 30, 2007·5 cites·45 claims
- 3274US6883903B2Flextensional transducer and method of forming flextensional transducerFiled 2003·Granted Apr 26, 2005·13 cites·22 claims
- 3373US6679587B2Fluid ejection device with a composite substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jan 20, 2004·11 cites·15 claims
- 3472US7611919B2Bonding interface for micro-device packagingHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Nov 3, 2009·4 cites·18 claims
- 3572US7087134B2System and method for direct-bonding of substratesHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Aug 8, 2006·21 cites·8 claims
- 3671US8733900B2Thermal inkjet print head with solvent resistanceVIDEOJET TECHNOLOGIES INC·Filed 2013·Granted May 27, 2014·1 cites·18 claims
- 3771US8043880B2Microelectronic deviceHEWLETT PACKARD DEVELOPMENT LP·Filed 2005·Granted Oct 25, 2011·4 cites·18 claims
- 3871US7018015B2Substrate and method of forming substrate for fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 28, 2006·11 cites·28 claims
- 3970US7125731B2Drop generator for ultra-small dropletsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Oct 24, 2006·10 cites·18 claims
- 4069US8960886B2Thermal inkjet print head with solvent resistanceVIDEOJET TECHNOLOGIES INC·Filed 2014·Granted Feb 24, 2015·1 cites·20 claims
- 4169US6821450B2Substrate and method of forming substrate for fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Nov 23, 2004·10 cites·24 claims
- 4267US7103972B2Method of fabricating a fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Sep 12, 2006·8 cites·17 claims
- 4366US7262498B2Assembly with a ring and bonding pads formed of a same material on a substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Aug 28, 2007·2 cites·20 claims
- 4466US2022219455A1Electrode structures for micro-valves for use in jetting assembliesMATTHEWS INT CORP·Filed 2021·Application pending·0 cites
- 4564US7018734B2Multi-element thin-film fuel cellHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Mar 28, 2006·4 cites·12 claims
- 4663US7443001B2Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputteringHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Oct 28, 2008·1 cites·20 claims
- 4762US6517735B2Ink feed trench etch technique for a fully integrated thermal inkjet printheadHEWLETT PACKARD CO·Filed 2001·Granted Feb 11, 2003·9 cites·20 claims
- 4861US7723811B2Packaged MEMS device assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted May 25, 2010·1 cites·11 claims
- 4961US7541209B2Method of forming a device package having edge interconnect padHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 2, 2009·1 cites·11 claims
- 5059US7655275B2Methods of controlling flowHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Feb 2, 2010·4 cites·18 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →