Inventor · disambiguated record
Chih-Kang Han
Also filed as: HAN CHIH-KANG
17 granted patents·3 pending applications·45 citations·filing 2010–2025
91Inventor score
Top patents by PatentIndex Score
20 records- 0197US9922896B1Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·18 cites·20 claims
- 0293US10290530B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·6 cites·20 claims
- 0390US10529697B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 7, 2020·5 cites·19 claims
- 0488US10128182B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·4 cites·20 claims
- 0587US10692809B2Manufacturing method for semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·3 cites·20 claims
- 0684US8610270B2Semiconductor device and semiconductor assembly with lead-free solderLAI YI-JEN·Filed 2010·Granted Dec 17, 2013·8 cites·19 claims
- 0783US12261074B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0882US2025201617A1Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0975US11984342B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 1074US11948881B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 1171US11990454B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 21, 2024·0 cites·19 claims
- 1270US11069614B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
- 1365US10950478B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 1465US10290590B2Stacked semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·18 claims
- 1562US2024266336A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1661US10867973B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 1757US9210449B2Video generating system with multiple image sensors and related method thereofPIXART IMAGING INC·Filed 2013·Granted Dec 8, 2015·0 cites·14 claims
- 1855US2024297087A1Package module with a module stiffener and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1953US8952534B2Semiconductor device and semiconductor assembly with lead-free solderTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 10, 2015·0 cites·19 claims
- 2049US9456147B2Video generating system with multiple image sensors and related method thereofPIXART IMAGING INC·Filed 2015·Granted Sep 27, 2016·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →