Inventor · disambiguated record
Cheolsoo Han
Also filed as: HAN CHEOLSOO
2 granted patents·1 pending application·0 citations·filing 2021–2023
22Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0146US12100635B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 24, 2024·0 cites·20 claims
- 0245US12300668B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 0337US2024023346A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →