Inventor · disambiguated record
Christopher J. Healy
Also filed as: HEALY CHRISTOPHER · HEALY CHRISTOPHER J · HEALY CHRISTOPHER JAMES
7 granted patents·1 pending application·59 citations·filing 2009–2020
82Inventor score
Top patents by PatentIndex Score
8 records- 0196US10410971B2Thermal and electromagnetic interference shielding for die embedded in package substrateQUALCOMM INC·Filed 2017·Granted Sep 10, 2019·37 cites·30 claims
- 0287US10002857B2Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layerQUALCOMM INC·Filed 2016·Granted Jun 19, 2018·10 cites·34 claims
- 0377US11450630B2Coupling of integrated circuits (ICS) through a passivation-defined contact padCIRRUS LOGIC INT SEMICONDUCTOR LTD·Filed 2020·Granted Sep 20, 2022·1 cites·18 claims
- 0468US9313881B2Through mold via relief gutter on molded laser package (MLP) packagesQUALCOMM INC·Filed 2013·Granted Apr 12, 2016·3 cites·32 claims
- 0564US8753926B2Electronic packaging with a variable thickness mold capHEALY CHRISTOPHER J·Filed 2010·Granted Jun 17, 2014·4 cites·17 claims
- 0664US8546921B2Hybrid multilayer substrateRAMADOSS VIVEK·Filed 2010·Granted Oct 1, 2013·4 cites·17 claims
- 0746US8371497B2Method for manufacturing tight pitch, flip chip integrated circuit packagesQUALCOMM INC·Filed 2009·Granted Feb 12, 2013·0 cites·19 claims
- 0833US2017271175A1Exposed die mold underfill (muf) with fine pitch copper (cu) pillar assembly and bump densityQUALCOMM INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →