Inventor · disambiguated record
Cheng Wei Ho
Also filed as: HO CHENG W · HO CHENG-WEI
2 granted patents·2 pending applications·29 citations·filing 1990–2025
55Inventor score
Top patents by PatentIndex Score
4 records- 0169US2025349784A1Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0265US2025309159A1Shifting contact pad for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0359US12394735B2Shifting contact pad for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 0456US5065989AWorktableHO CHENG W·Filed 1990·Granted Nov 19, 1991·29 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →