Inventor · disambiguated record
Chung-Hsiung Ho
Also filed as: HO CHUNG HSIUNG
18 granted patents·34 pending applications·28 citations·filing 2005–2024
89Inventor score
Top patents by PatentIndex Score
52 records- 0187US10008454B1Wafer level package with EMI shieldingNXP BV·Filed 2017·Granted Jun 26, 2018·6 cites·7 claims
- 0286US10390440B1Solderless inter-component jointsNXP BV·Filed 2018·Granted Aug 20, 2019·8 cites·15 claims
- 0386US9892989B1Wafer-level chip scale package with side protectionNXP BV·Filed 2016·Granted Feb 13, 2018·5 cites·9 claims
- 0481US10192837B1Multi-via redistribution layer for integrated circuits having solder ballsNXP BV·Filed 2017·Granted Jan 29, 2019·4 cites·16 claims
- 0580US10211071B2IC packaging method and a packaged IC deviceNXP BV·Filed 2016·Granted Feb 19, 2019·4 cites·20 claims
- 0675US11049781B1Chip-scale package devicePANJIT INT INC·Filed 2020·Granted Jun 29, 2021·1 cites·9 claims
- 0763US11916030B2Method for manufacturing side wettable packagePANJIT INT INC·Filed 2022·Granted Feb 27, 2024·0 cites·4 claims
- 0862US11848254B2Method for manufacturing a semiconductor package having a conductive pad with an anchor flangePANJIT INT INC·Filed 2021·Granted Dec 19, 2023·0 cites·7 claims
- 0962US2025125292A1Side-wettable package with edge-recessed bond padsPANJIT INT INC·Filed 2024·Application pending·0 cites
- 1061US2025253202A1Semiconductor package with heat-dissipation interfacePANJIT INT INC·Filed 2024·Application pending·0 cites
- 1160US11562947B2Semiconductor package having a conductive pad with an anchor flangePANJIT INT INC·Filed 2020·Granted Jan 24, 2023·0 cites·7 claims
- 1260US11387203B2Side wettable packagePANJIT INT INC·Filed 2020·Granted Jul 12, 2022·0 cites·4 claims
- 1360US2025218927A1Flat packagePANJIT INT INC·Filed 2024·Application pending·0 cites
- 1459US2025239500A1Lamination structure manufactured by laser patterningPANJIT INT INC·Filed 2024·Application pending·0 cites
- 1558US2025201752A1Semiconductor package structure and byproduct of semiconductor componentPANJIT INT INC·Filed 2024·Application pending·0 cites
- 1657US12288737B2Thin semiconductor packaging unit having a plurality of bridging layersPANJIT INT INC·Filed 2022·Granted Apr 29, 2025·0 cites·16 claims
- 1757US12224228B2Packaged component with composite pin structure and manufacturing method thereofPANJIT INT INC·Filed 2022·Granted Feb 11, 2025·0 cites·14 claims
- 1857US2025107117A1Schottky diode with low reverse current and high heat dissipation effectPANJIT INT INC·Filed 2023·Application pending·0 cites
- 1956US12408407B2Metal oxide semiconductor with multiple drain viasPANJIT INT INC·Filed 2022·Granted Sep 2, 2025·0 cites·6 claims
- 2056US2025120008A1Package capable of eliminating bubble formationPANJIT INT INC·Filed 2023·Application pending·0 cites
- 2156US2025112130A1Flat semiconductor package with coplanar leadsPANJIT INT INC·Filed 2023·Application pending·0 cites
- 2256US2024290668A1Semiconductor device without resistance trimming padsPANJIT INT INC·Filed 2023·Application pending·0 cites
- 2355US2025212372A1Power supply unit with improved space utilization and heat dissipationPANJIT INT INC·Filed 2024·Application pending·0 cites
- 2455US2024355716A1Side-wettable semiconductor package device with heat dissipation surface structurePANJIT INT INC·Filed 2023·Application pending·0 cites
- 2554US2025056902A1Solar cell module and method for manufacturing the samePANJIT INT INC·Filed 2024·Application pending·0 cites
- 2653US2024355703A1Heat dissipative semiconductor packagePANJIT INT INC·Filed 2023·Application pending·0 cites
- 2752US2024030155A1Wafer level chip scale package unitPANJIT INT INC·Filed 2022·Application pending·0 cites
- 2852US2025239499A1Ultra-thin packaged componentPANJIT INT INC·Filed 2024·Application pending·0 cites
- 2952US2024112943A1Die suction assistance devicePANJIT INT INC·Filed 2022·Application pending·0 cites
- 3052US2025323171A1Side wettable semiconductor package with probe marksPANJIT INT INC·Filed 2024·Application pending·0 cites
- 3152US2024128185A1Semiconductor device and pre-forming adaptor thereofPANJIT INT INC·Filed 2022·Application pending·0 cites
- 3251US11664345B2Semiconductor package elementPANJIT INT INC·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 3351US2024387350A1Package with embedded tracesPANJIT INT INC·Filed 2023·Application pending·0 cites
- 3451US2024120241A1Packaging device capable of detecting risk of impact of electrostatic chargesPANJIT INT INC·Filed 2022·Application pending·0 cites
- 3551US2024310412A1Universal probe card and testing methodPANJIT INT INC·Filed 2023·Application pending·0 cites
- 3648US2025069974A1Wafer level packaging component having side wettable structurePANJIT INT INC·Filed 2023·Application pending·0 cites
- 3747US11594425B2Semiconductor package structure and fabricating method of the samePANJIT INT INC·Filed 2020·Granted Feb 28, 2023·0 cites·8 claims
- 3847US2022406620A1Fabricating method for wafer level semiconductor package device and the fabricated semiconductor package devicePANJIT INT INC·Filed 2021·Application pending·0 cites
- 3945US12148675B2Power semiconductor package unit of surface mount technology including a plastic film covering a chipPANJIT INT INC·Filed 2021·Granted Nov 19, 2024·0 cites·14 claims
- 4045US2025140573A1Method of manufacturing pre-molded lead frame for packagingPANJIT INT INC·Filed 2023·Application pending·0 cites
- 4144US2023395553A1Package device preventing solder overflowPANJIT INT INC·Filed 2022·Application pending·0 cites
- 4243US2022157707A1Thin semiconductor package and manufacturing method thereofPANJIT INT INC·Filed 2020·Application pending·0 cites
- 4343US2023395465A1Semiconductor package with solderable sidewallPANJIT INT INC·Filed 2022·Application pending·0 cites
- 4440US2014264784A1Metal Shielding on Die LevelNXP BV·Filed 2013·Application pending·0 cites
- 4538US2006091384A1Substrate testing apparatus with full contact configurationADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 4638US2013157414A1Stacked-die package and method thereforNXP BV·Filed 2012·Application pending·0 cites
- 4737US2016148842A1Dicing of low-k wafersNXP BV·Filed 2014·Application pending·0 cites
- 4837US2012188721A1Non-metal stiffener ring for fcbgaHO CHUNG HSIUNG·Filed 2011·Application pending·0 cites
- 4936US2019088504A1Wafer level package and method of assembling sameNXP BV·Filed 2017·Application pending·0 cites
- 5035US10825781B2Semiconductor device with conductive film shieldingNXP BV·Filed 2018·Granted Nov 3, 2020·0 cites·17 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →