Inventor · disambiguated record
Chi-Ching Ho
Also filed as: HO CHI-CHING
17 granted patents·17 pending applications·10 citations·filing 2012–2025
88Inventor score
Top patents by PatentIndex Score
34 records- 0195US11315881B1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Apr 26, 2022·7 cites·14 claims
- 0278US12412820B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·12 claims
- 0378US12412819B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·9 claims
- 0474US2025038113A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0573US12125828B2Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·12 claims
- 0673US2025087601A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0772US2025015054A1Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0871US2025279375A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0970US12176291B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·18 claims
- 1069US12438094B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·16 claims
- 1169US12334452B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 1268US9991197B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 5, 2018·1 cites·9 claims
- 1368US8810045B2Packaging substrate and semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Aug 19, 2014·2 cites·9 claims
- 1467US12199047B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·6 claims
- 1567US12051641B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·9 claims
- 1666US12476229B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·11 claims
- 1760US2025183239A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1859US2025336739A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1958US2025311452A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2058US2025140765A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2156US2025140770A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2255US2025079254A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2355US2024371721A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2454US11923337B2Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Mar 5, 2024·0 cites·20 claims
- 2553US2024363545A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2652US9006039B2Fabrication method of packaging substrate, and fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Apr 14, 2015·0 cites·9 claims
- 2752US2024264389A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2850US9899235B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·12 claims
- 2950US2015144384A1Packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 3047US9265154B2Packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 16, 2016·0 cites·14 claims
- 3147US9165789B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 20, 2015·0 cites·4 claims
- 3247US2014091462A1Semiconductor package and fabrication method thereofPREC IND CO LTD SILICONWARE·Filed 2012·Application pending·0 cites
- 3337US2019043819A1Electronic package having redistribution structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 3437US2013292832A1Semiconductor package and fabrication method thereofTANG SHAO-TZU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →