Inventor · disambiguated record
Cheng-Yi Hong
Also filed as: HONG CHENG-YI
10 granted patents·1 pending application·121 citations·filing 2013–2025
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0198US10741537B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·36 cites·20 claims
- 0298US8941248B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·70 cites·20 claims
- 0391US11335672B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·20 claims
- 0489US9502323B2Method of forming encapsulated semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·6 cites·20 claims
- 0586US10276551B2Semiconductor device package and method of forming semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·14 claims
- 0685US12322742B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 0785US2025266417A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0884US10714463B2Method of forming semicondcutor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·2 cites·20 claims
- 0982US10504880B2Method of forming semicondcutor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 10, 2019·2 cites·20 claims
- 1079US11855066B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1171US11508710B2Method of forming semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →