Inventor · disambiguated record
Chii Shang Hong
Also filed as: HONG CHII SHANG
15 granted patents·4 pending applications·7 citations·filing 2018–2025
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
19 records- 0194US11876028B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 16, 2024·2 cites·20 claims
- 0282US11075185B2Semiconductor package with multi-level conductive clip for top side coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 27, 2021·4 cites·16 claims
- 0381US11908771B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 20, 2024·1 cites·23 claims
- 0480US12094793B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 0578US2024395646A1Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0671US12334414B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2024·Granted Jun 17, 2025·0 cites·24 claims
- 0767US12080625B2Semiconductor package with releasable isolation layer protectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Sep 3, 2024·0 cites·11 claims
- 0857US11942383B2Linear spacer for spacing a carrier of a packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 26, 2024·0 cites·15 claims
- 0957US11791238B2Semiconductor package with releasable isolation layer protectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Oct 17, 2023·0 cites·9 claims
- 1056US10971436B2Multi-branch terminal for integrated circuit (IC) packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 1154US12512380B2Semiconductor packages including a package body with grooves formed thereinINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1254US10354943B1Multi-branch terminal for integrated circuit (IC) packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 16, 2019·0 cites·20 claims
- 1352US2023361009A1Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further deviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1450US11289436B2Semiconductor package having a laser-activatable mold compoundINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Mar 29, 2022·0 cites·13 claims
- 1549US11804424B2Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 1648US2025293127A1Leadframe panel, a semiconductor package comprising a leadframe with a two-level dambar design and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1748US2025308942A1Method of forming a die package and die packageINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1840US10978380B2Semiconductor package with multi-level conductive clip for top side coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 13, 2021·0 cites·17 claims
- 1939US10840164B2Wire bonded package with single piece exposed heat slug and leadsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 17, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →