Inventor · disambiguated record
Ching-Fu Horng
Also filed as: HORNG CHING-FU
5 granted patents·64 citations·filing 2003–2006
80Inventor score
Files withADVANCED SEMICONDUCTOR ENG5
Top patents by PatentIndex Score
5 records- 0184US7523551B2Manufacturing method of a multi-layer circuit board embedded with a passive componentADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Apr 28, 2009·17 cites·15 claims
- 0284US7338892B2Circuit carrier and manufacturing process thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Mar 4, 2008·15 cites·10 claims
- 0372US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 0459US7091121B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 15, 2006·11 cites·20 claims
- 0545US7112523B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Sep 26, 2006·3 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →