Inventor · disambiguated record
Chih-Horng Horng
Also filed as: HORNG CHIH-HORNG
6 granted patents·3 pending applications·12 citations·filing 2002–2025
74Inventor score
Files withABLEPRINT TECH CO LTD4HORNG CHIH-HORNG2MORNINGMOVING TECHNOLOGY CO LTD1ULTRA TERA CORP1ULTRATERA CORP1
Top patents by PatentIndex Score
9 records- 0162US8893378B2Method for securing a carrier by gas pressurization to inhibit warpage of the carrierHORNG CHIH-HORNG·Filed 2012·Granted Nov 25, 2014·2 cites·10 claims
- 0259US9196600B2Device and method for chip pressingHORNG CHIH-HORNG·Filed 2012·Granted Nov 24, 2015·2 cites·39 claims
- 0350US7122407B2Method for fabricating window ball grid array semiconductor packageULTRA TERA CORP·Filed 2004·Granted Oct 17, 2006·6 cites·11 claims
- 0447US2014178274A1Method For Adjusting Temperature By Increasing Gas Molecular DensityMORNINGMOVING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 0546US2025372575A1Process for flip chip packagingABLEPRINT TECH CO LTD·Filed 2025·Application pending·0 cites
- 0644US12040239B2Method for suppressing material warpage by increasing gas densityABLEPRINT TECH CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·6 claims
- 0744US11589488B1Warpage suppressing reflow ovenABLEPRINT TECH CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·10 claims
- 0844US2025254758A1Foreign object removal apparatus for packaged electronic components, and anomaly control method thereofABLEPRINT TECH CO LTD·Filed 2025·Application pending·0 cites
- 0941US6869824B2Fabrication method of window-type ball grid array semiconductor packageULTRATERA CORP·Filed 2002·Granted Mar 22, 2005·2 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →