Inventor · disambiguated record
Chisato Hoshino
Also filed as: HOSHINO CHISATO
3 granted patents·3 pending applications·30 citations·filing 2004–2024
70Inventor score
Top patents by PatentIndex Score
6 records- 0183US8187490B2Heat dissipating material and semiconductor device using sameTABEI SHINGO·Filed 2007·Granted May 29, 2012·10 cites·4 claims
- 0280US8221645B2Heat dissipating material and semiconductor device using sameTABEI SHINGO·Filed 2011·Granted Jul 17, 2012·4 cites·3 claims
- 0374US2025092259A1Thermally conductive silicone compositionMOMENTIVE PERFORMANCE MAT JP·Filed 2024·Application pending·0 cites
- 0473US7692032B2Thermal conductive silicone compositionMOMENTIVE PERFORMANCE MAT INC·Filed 2004·Granted Apr 6, 2010·16 cites·4 claims
- 0561US2024059843A1Thermal gel compositionMOMENTIVE PERFORMANCE MAT INC·Filed 2022·Application pending·0 cites
- 0642US2008139725A1Heat Radiating Silicone CompositionTAKEMURA KUNIO·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →