Inventor · disambiguated record
Chin-Chih Hsiao
Also filed as: HSIAO CHIN-CHIH
2 granted patents·1 pending application·0 citations·filing 2012–2023
27Inventor score
Top patents by PatentIndex Score
3 records- 0144US2024266193A1Working system for semiconductor packaging process and operation method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 0242US9171741B2Packaging substrate and fabrication method thereofWANG WEI-PING·Filed 2012·Granted Oct 27, 2015·0 cites·11 claims
- 0339US9455159B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Sep 27, 2016·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →