Inventor · disambiguated record
Chih-Min Hsiao
Also filed as: HSIAO CHIH-MIN
20 granted patents·11 pending applications·8 citations·filing 2019–2025
90Inventor score
Top patents by PatentIndex Score
31 records- 0193US11715638B2Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 0290US11322362B2Landing metal etch process for improved overlay controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·4 cites·20 claims
- 0390US2025357322A1Diagonal via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0487US11699589B2Method for forming patterned mask layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·1 cites·20 claims
- 0583US12014926B2Self aligned litho etch process patterning methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 0683US2024297042A1Method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0783US2024371653A1Landing metal etch process for improved overlay controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0882US12125712B2Landing metal etch process for improved overlay controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0981US12494359B2Stacked wafer structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 1080US2024162142A1Diagonal via manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1179US12266528B2Method for forming patterned mask layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 1279US2025040224A1Integrated circuit, system and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1378US12062543B2Line-end extension method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 1478US10991583B2Self aligned litho etch process patterning methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 27, 2021·1 cites·20 claims
- 1578US2023387002A1Diagonal via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1677US12243744B2Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1777US11798812B2Landing metal etch process for improved overlay controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1877US2024087896A1Line-end extension method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1975US11610778B2Self aligned litho etch process patterning methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 2075US2025357208A1Area selective deposition for zero via enclosure and extremely small metal line end spaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2175US2025201562A1Method for forming patterned mask layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2273US11901286B2Diagonal via pattern and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 2372US2025096004A1Semiconductor structures and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2468US12255238B2Integrated circuit, system and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 2568US11854807B2Line-end extension method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 2667US12191155B2Semiconductor structures and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 2767US12080544B2Stacked wafer structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 2866US12494411B2Integrated circuit and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 2961US2023282514A1Area selective deposition for zero via enclosure and extremely small metal line end spaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3051US11201064B2Signal line patterning for standard cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 14, 2021·0 cites·20 claims
- 3146US12265739B2Data access interface unit and the method for processing I/O requestsINFORTREND TECH INC·Filed 2023·Granted Apr 1, 2025·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →