Inventor · disambiguated record
Chi Hsiang Hsieh
Also filed as: HSIEH CHI-HSIANG
1 granted patent·1 pending application·13 citations·filing 2012–2017
35Inventor score
Technology areasH10P
Top patents by PatentIndex Score
2 records- 0180US9375821B2Electrically assisted chemical-mechanical planarization (EACMP) system and method thereofCHEN CHAO-CHANG·Filed 2012·Granted Jun 28, 2016·13 cites·18 claims
- 0231US2018358443A1Silicon carbide wafer and positioning edge processing method thereofGLOBALWAFERS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →