Inventor · disambiguated record
Cheng-Yen Hsieh
Also filed as: HSIEH CHENG-YEN
5 granted patents·4 pending applications·23 citations·filing 2019–2025
73Inventor score
Top patents by PatentIndex Score
9 records- 0195US11545438B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·12 cites·20 claims
- 0292US10867892B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·11 cites·20 claims
- 0380US12374599B2Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0480US2025309043A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0575US2025336833A1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0668US12431435B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 0768US11915994B2Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·15 claims
- 0851US2025232832A1Method, device and medium for protein language modelBYTEDANCE TECH LTD·Filed 2025·Application pending·0 cites
- 0949US2024145421A1Passivation layer for forming semiconductor bonding structure, sputtering target making the same, semiconductor bonding structure and semiconductor bonding processSOLAR APPLIED MATERIALS TECH CORP·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Cheng-Yen Hsieh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →