Inventor · disambiguated record
Chueh-An Hsieh
Also filed as: HSIEH CHUEH · HSIEH CHUEH-AN
4 granted patents·5 pending applications·30 citations·filing 2005–2022
72Inventor score
Top patents by PatentIndex Score
9 records- 0182US7727818B2Substrate process for an embedded componentADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jun 1, 2010·14 cites·14 claims
- 0277US7651937B2Bumping process and structure thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 26, 2010·9 cites·8 claims
- 0372US7518241B2Wafer structure with a multi-layer barrier in an UBM layer network device with power supplyADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 14, 2009·7 cites·14 claims
- 0450US2024088032A1Structure and Method of Fabrication for High Performance Integrated Passive DeviceAPPLE INC·Filed 2022·Application pending·0 cites
- 0545US7541273B2Method for forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 2, 2009·0 cites·12 claims
- 0645US2010314746A1Semiconductor package and manufacturing method thereofHSIEH CHUEH-AN·Filed 2009·Application pending·0 cites
- 0745US2008127434A1Method for manufacturing soft shoesHSIEH CHUEH·Filed 2005·Application pending·0 cites
- 0840US2007108612A1Chip structure and manufacturing method of the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 0939US2007120269A1Flip chip package and manufacturing method of the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →