Inventor · disambiguated record
Chih-Cheng Hsieh
Also filed as: HSIEH CHIH H · HSIEH CHIH-CHENG
28 granted patents·17 pending applications·61 citations·filing 2000–2025
93Inventor score
Files withNIKO SEMICONDUCTOR CO LTD16HSIEH CHIH-CHENG9PIXART IMAGING INC5UNIV NAT TSING HUA4TAIWAN SEMICONDUCTOR MFG CO LTD2
Top patents by PatentIndex Score
45 records- 0187US12048122B2Power module and power deviceNIKO SEMICONDUCTOR CO LTD·Filed 2022·Granted Jul 23, 2024·1 cites·15 claims
- 0287US11048650B1Method and system for integrating processing-in-sensor unit and in-memory computing unitUNIV NAT TSING HUA·Filed 2020·Granted Jun 29, 2021·3 cites·10 claims
- 0384US11785353B1Image sensor chip and sensing method thereofUNIV NAT TSING HUA·Filed 2022·Granted Oct 10, 2023·2 cites·27 claims
- 0483US9007078B2Pixel array module with self-test function and method thereofHSIEH CHIH-CHENG·Filed 2012·Granted Apr 14, 2015·9 cites·26 claims
- 0581US7323378B2Method for fabricating CMOS image sensorPIXART IMAGING INC·Filed 2005·Granted Jan 29, 2008·6 cites·10 claims
- 0678US6377120B1Regulated-cascode amplifier with clamping circuitPIXART IMAGING INC·Filed 2000·Granted Apr 23, 2002·28 cites·6 claims
- 0767US7436011B2CMOS image sensorPIXART IMAGING INC·Filed 2005·Granted Oct 14, 2008·1 cites·19 claims
- 0867US2025363768A1Image sensor and method of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0964US7169633B2Solid-state image sensor for improving sensing quality and manufacturing method thereofPIXART IMAGING INC·Filed 2004·Granted Jan 30, 2007·10 cites·5 claims
- 1061US9029753B2Optical recognition system and method thereofNAT UNIV TSING HUA·Filed 2012·Granted May 12, 2015·1 cites·5 claims
- 1158US2025379125A1Double-sided power device and method for manufacturing the sameNIKO SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1257US12400930B2Power module packageNIKO SEMICONDUCTOR CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·10 claims
- 1356US2025380365A1Circuit substrate assembly and power moduleNIKO SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1454US12430869B2Image sensor and method of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 1553US10629452B2Manufacturing method of a chip package structureNIKO SEMICONDUCTOR CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·9 claims
- 1653US10297522B2Semiconductor package structure and manufacturing method thereofNIKO SEMICONDUCTOR CO LTD·Filed 2018·Granted May 21, 2019·0 cites·8 claims
- 1753US2023369186A1Power module packageNIKO SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1850US11387180B2Power module including a carrier assembly with combination of circuit board and lead frameNIKO SEMICONDUCTOR CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·11 claims
- 1950US10043728B2Semiconductor package structure and manufacturing method thereofNIKO SEMICONDUCTOR CO LTD·Filed 2017·Granted Aug 7, 2018·0 cites·7 claims
- 2049US10381268B2Fan-out wafer level chip package structureNIKO SEMICONDUCTOR CO LTD·Filed 2017·Granted Aug 13, 2019·0 cites·5 claims
- 2149US7705367B2Pinned photodiode sensor with gate-controlled silicon-controlled rectifier transfer switch and method of formationPIXART IMAGING INC·Filed 2006·Granted Apr 27, 2010·0 cites·13 claims
- 2248US11770642B2Image sensor integrated with convolutional neural network computation circuitUNIV NAT TSING HUA·Filed 2022·Granted Sep 26, 2023·0 cites·10 claims
- 2348US9947551B2Chip package structure and manufacturing method thereofNIKO SEMICONDUCTOR CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·5 claims
- 2447US2012205520A1Image sensor and sensing method thereofHSIEH CHIH-CHENG·Filed 2011·Application pending·0 cites
- 2546US9299592B2Package structure and packaging method of wafer level chip scale packageHSIEH CHIH-CHENG·Filed 2014·Granted Mar 29, 2016·0 cites·9 claims
- 2645US9799563B2Fan-out wafer level chip package structure and manufacturing method thereofNIKO SEMICONDUCTOR CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·11 claims
- 2744US10668815B2Brake energy recovery moduleNIKO SEMICONDUCTOR CO LTD·Filed 2017·Granted Jun 2, 2020·0 cites·10 claims
- 2844US2005253958A1Integrated image capturing deviceHSIEH CHIH-CHENG·Filed 2004·Application pending·0 cites
- 2943US2004212705A1Method and apparatus for defect compensation in an image sensorFiled 2003·Application pending·0 cites
- 3042US2007075219A1Active pixel sensor circuit and related controlling methodHSIEH CHIH-CHENG·Filed 2006·Application pending·0 cites
- 3142US2004051800A1Readout circuit with on-sensor-chip two-dimensional interpolationFiled 2002·Application pending·0 cites
- 3241US8704580B2Circuit sharing time delay integratorCHIU CHIN-FONG·Filed 2012·Granted Apr 22, 2014·0 cites·15 claims
- 3341US2007120213A1Wire under dam package and method for packaging image-sensorHIEW SIEW S·Filed 2005·Application pending·0 cites
- 3439US2007280313A1Method and Apparatus for Driving a Light Emitting DeviceHSIEH CHIH-CHENG·Filed 2006·Application pending·0 cites
- 3539US2013313696A1Power semiconductor package and method of manufacturing the sameNIKO SEMICONDUCTOR CO LTD·Filed 2012·Application pending·0 cites
- 3638US11683605B2Image sensor chip and sensing method thereofEGIS TECH INC·Filed 2021·Granted Jun 20, 2023·0 cites·26 claims
- 3738US9337049B1Manufacturing method of wafer level chip scale package structureNIKO SEMICONDUCTOR CO LTD·Filed 2015·Granted May 10, 2016·0 cites·12 claims
- 3838US8729632B2Semiconductor structure with low resistance of substrate and low power consumptionHSU HSIU WEN·Filed 2011·Granted May 20, 2014·0 cites·12 claims
- 3938US2006275940A1Method for controlling well capacity of a photodiodeSU MING-CHUN·Filed 2006·Application pending·0 cites
- 4037US2005230597A1Image sensing device for improving image quality and reducing color shift effectHSIEH CHIH-CHENG·Filed 2004·Application pending·0 cites
- 4137US2005247854A1Integrated auto-focusing deviceHSIEH CHIH-CHENG·Filed 2004·Application pending·0 cites
- 4236US10742183B2Processing device for position sensing comprising a transforming differential current signal to a voltage signal performanceIND TECH RES INST·Filed 2018·Granted Aug 11, 2020·0 cites·12 claims
- 4336US2006017830A1Active pixel sensor with isolated photo-sensing region and peripheral circuit regionHSIEH CHIH-CHENG·Filed 2004·Application pending·0 cites
- 4434US9881897B2Manufacturing method of ultra-thin semiconductor device package assemblyNIKO SEMICONDUCTOR CO LTD·Filed 2015·Granted Jan 30, 2018·0 cites·11 claims
- 4530US2018000393A1Multiple physiological signals sensing chip and the multiple physiological signals sensing method thereofUNIV NAT TSING HUA·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →