Inventor · disambiguated record
Chen-Chih Hsieh
Also filed as: HSIEH CHEN-CHIH
4 granted patents·11 citations·filing 2013–2015
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0186US9035468B2Copper post structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 19, 2015·8 cites·19 claims
- 0267US9589915B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 7, 2017·2 cites·20 claims
- 0362US9379076B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·1 cites·20 claims
- 0448US9343415B2Copper post structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 17, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →