Inventor · disambiguated record
Cheng-Hsien Hsieh
Also filed as: HSIEH CHENG-HSIEN
56 granted patents·19 pending applications·1,332 citations·filing 2005–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD64NANYA TECHNOLOGY CORP3FKA DISTRIBUTING CO2TAIWAN SEMICONDUCTOR MFG2UNIV NAT YUNLIN SCI & TECH2
Top patents by PatentIndex Score
75 records- 0199US11508695B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·7 cites·20 claims
- 0299US10062648B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·70 cites·19 claims
- 0399US9997464B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·64 cites·20 claims
- 0499US9741690B1Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·52 cites·20 claims
- 0598US9299649B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 29, 2016·902 cites·22 claims
- 0697US9929112B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 27, 2018·19 cites·20 claims
- 0796US11069539B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·3 cites·20 claims
- 0896US10475768B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 12, 2019·11 cites·20 claims
- 0996US9793231B2Under bump metallurgy (UBM) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 17, 2017·15 cites·19 claims
- 1096US9502343B1Dummy metal with zigzagged edgesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·14 cites·20 claims
- 1195US9812426B1Integrated fan-out package, semiconductor device, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·19 cites·20 claims
- 1295US9355980B2Three-dimensional chip stack and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·19 cites·20 claims
- 1394US11515229B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·3 cites·20 claims
- 1494US9640496B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·11 cites·17 claims
- 1593US10269584B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·7 cites·19 claims
- 1693US10141288B2Surface mount device/integrated passive device on package or device structure and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 27, 2018·9 cites·20 claims
- 1792US9627288B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 18, 2017·9 cites·16 claims
- 1892USD577440SBlood pressure monitorFKA DISTRIBUTING CO·Filed 2007·Granted Sep 23, 2008·42 cites·1 claims
- 1991US10109607B2Under bump metallurgy (UBM) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 23, 2018·6 cites·20 claims
- 2089US12322726B2Method of forming an integrated circuit package having a padding layer on a carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·1 cites·20 claims
- 2189US10165682B2Opening in the pad for bonding integrated passive device in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·4 cites·10 claims
- 2288US11581268B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 2388US10950577B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·3 cites·20 claims
- 2488US10818800B2Semiconductor structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2018·Granted Oct 27, 2020·5 cites·14 claims
- 2588US10665474B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 26, 2020·3 cites·20 claims
- 2687US10763212B1Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2019·Granted Sep 1, 2020·6 cites·19 claims
- 2786US10714426B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·3 cites·20 claims
- 2884US12506087B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 2982US11018088B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·2 cites·20 claims
- 3082US10416566B2Optimization of source and bandwidth for new and existing patterning devicesCymer LLC·Filed 2016·Granted Sep 17, 2019·3 cites·20 claims
- 3181US2025087550A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3280US11955439B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 3380US10629537B2Conductive vias in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·2 cites·20 claims
- 3479US11612057B2Opening in the pad for bonding integrated passive device in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 21, 2023·0 cites·20 claims
- 3579US2025357234A1PACKAGING OF DIES INCLUDING TSVs USING SACRIFICIAL CARRIERTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3679US2025357383A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3778US10504751B2Package structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·2 cites·20 claims
- 3878US2025329666A1Stress buffer in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3978US2025329669A1Seal rings in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4078US2025343173A1Forming shallow trench for dicing and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4177US10163805B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·2 cites·20 claims
- 4276US12191224B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 4376US10510654B2Dummy metal with zigzagged edgesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 4475US11830745B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·19 claims
- 4574US2025286016A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4673US11470720B2Opening in the pad for bonding integrated passive device in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·20 claims
- 4772US11855018B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 4872US10319681B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 11, 2019·1 cites·20 claims
- 4971US10290584B2Conductive vias in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·20 claims
- 5071US2024413102A1Forming shallow trench for dicing and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 75 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →