Inventor · disambiguated record
Chia-Hsiung Hsieh
Also filed as: HSIEH CHIA-HSIUNG
4 granted patents·27 citations·filing 2010–2014
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0189US8288869B2Semiconductor package with substrate having single metal layer and manufacturing methods thereofHUANG SHIH-FU·Filed 2010·Granted Oct 16, 2012·15 cites·20 claims
- 0285US8786062B2Semiconductor package and process for fabricating sameSU YUAN-CHANG·Filed 2010·Granted Jul 22, 2014·8 cites·6 claims
- 0369US9165900B2Semiconductor package and process for fabricating sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Oct 20, 2015·2 cites·20 claims
- 0463US8357861B2Circuit board, and chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Jan 22, 2013·2 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →