Inventor · disambiguated record

Cheng-Chieh Hsieh

Also filed as: HSIEH CHENG-CHIEH

93 granted patents·29 pending applications·396 citations·filing 2008–2025

99Inventor score

Technology areasH10W G02B H10D H05K F21V

Files withTAIWAN SEMICONDUCTOR MFG CO LTD100 TAIWAN SEMICONDUCTOR MFG9 HSIEH CHENG-CHIEH4 YU CHEN-HUA3 INTEL CORP2

Top patents by PatentIndex Score

122 records

0199US9613931B2Fan-out stacked system in package (SIP) having dummy dies and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·64 cites·19 claims
0298US12132024B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·4 cites·20 claims
0398US11527502B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·4 cites·20 claims
0498US11410932B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·5 cites·20 claims
0598US11139249B2Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 5, 2021·6 cites·20 claims
0698US8519537B23D semiconductor package interposer with die cavityJENG SHIN-PUU·Filed 2010·Granted Aug 27, 2013·81 cites·19 claims
0797US11901320B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
0897US11809000B2Photonic integrated circuit and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·4 cites·20 claims
0997US11798925B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·3 cites·20 claims
1097US11664325B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 30, 2023·3 cites·20 claims
1197US11244906B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·5 cites·15 claims
1296US11506843B1Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·5 cites·20 claims
1396US11251119B2Package structure, package-on-package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
1495US12368141B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·19 claims
1595US11614592B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 28, 2023·3 cites·20 claims
1695US10475877B1Multi-terminal inductor for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·6 cites·20 claims
1795US9741638B2Thermal structure for integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·22 cites·20 claims
1895US8664760B2Connector design for packaging integrated circuitsYU CHEN-HUA·Filed 2012·Granted Mar 4, 2014·18 cites·11 claims
1994US8865521B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 21, 2014·16 cites·20 claims
2093US10269682B2Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·9 cites·21 claims
2193US9691686B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 27, 2017·10 cites·20 claims
2293US9508666B2Packaging structures and methods with a metal pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·13 cites·17 claims
2392US12222545B2Package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·1 cites·20 claims
2492US11121052B2Integrated fan-out device, 3D-IC system, and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·8 cites·20 claims
2592US10163861B2Semiconductor package for thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·6 cites·20 claims
2691US10910321B2Semiconductor device and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 2, 2021·6 cites·20 claims
2790US11088125B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·19 claims
2890US9449947B2Semiconductor package for thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·7 cites·20 claims
2988US11635566B2Package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 25, 2023·2 cites·20 claims
3088US9640490B2Through silicon via keep out zone formation method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·5 cites·20 claims
3187US12374627B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
3286US10290604B2Substrateless integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
3386US2025355202A1Photonic integrated circuit and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3486US2025349778A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3585US8604619B2Through silicon via keep out zone formation along different crystal orientationsHSIEH CHENG-CHIEH·Filed 2011·Granted Dec 10, 2013·6 cites·19 claims
3684US12210200B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 28, 2025·0 cites·20 claims
3784US10930605B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·2 cites·20 claims
3884US10153218B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·4 cites·20 claims
3984US10062664B2Semiconductor packaging device with heat sinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·4 cites·18 claims
4084US8836094B1Package device including an opening in a flexible substrate and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 16, 2014·7 cites·19 claims
4184US2024405005A1Ipd modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4284US2024371787A1Semiconductor device and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4384US2025123458A1Photonic Semiconductor Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4483US12362329B2Method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
4583US2025309122A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4682US12113031B2Semiconductor device and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
4782US11804475B2Semiconductor package for thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 31, 2023·0 cites·20 claims
4882US9842825B2Substrateless integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 12, 2017·5 cites·20 claims
4981US12266639B2Method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
5081US12105323B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims

Showing the top 50 of 122 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →