Inventor · disambiguated record
Chien-Min Hsu
Also filed as: HSU CHIEN-MIN
16 granted patents·1 pending application·55 citations·filing 2007–2023
90Inventor score
Top patents by PatentIndex Score
17 records- 0190US9706656B2Signal transmission board and method for manufacturing the sameIND TECH RES INST·Filed 2015·Granted Jul 11, 2017·9 cites·21 claims
- 0289US8094429B2Multilayer capacitors and methods for making the sameHSU CHIEN-MIN·Filed 2009·Granted Jan 10, 2012·18 cites·27 claims
- 0384US7742276B2Wiring structure of laminated capacitorsIND TECH RES INST·Filed 2007·Granted Jun 22, 2010·12 cites·19 claims
- 0475US10405418B2Differential signal transmitting circuit boardIND TECH RES INST·Filed 2016·Granted Sep 3, 2019·2 cites·17 claims
- 0575US9013893B2Embedded capacitor moduleIND TECH RES INST·Filed 2013·Granted Apr 21, 2015·4 cites·35 claims
- 0668US8125761B2Capacitor devices with co-coupling electrode planesHSU CHIEN-MIN·Filed 2009·Granted Feb 28, 2012·4 cites·23 claims
- 0767US8071890B2Electrically conductive structure of circuit board and circuit board using the sameHSU CHIEN-MIN·Filed 2008·Granted Dec 6, 2011·3 cites·22 claims
- 0864US8941015B2Embedded capacitor substrate moduleHSU CHIEN-MIN·Filed 2011·Granted Jan 27, 2015·1 cites·23 claims
- 0961US11917754B2Antenna module with keep-out areaIND TECH RES INST·Filed 2021·Granted Feb 27, 2024·0 cites·10 claims
- 1055US11239146B2Package structureIND TECH RES INST·Filed 2020·Granted Feb 1, 2022·0 cites·12 claims
- 1155US8198538B2Capacitor devices having multi-sectional conductorsHSU CHIEN-MIN·Filed 2009·Granted Jun 12, 2012·2 cites·14 claims
- 1254US2025139349A1Multi-die integrated package design method and system using the sameIND TECH RES INST·Filed 2023·Application pending·0 cites
- 1353US9595754B2Patterned conductive structure and method for forming the sameWISTRON NEWEB CORP·Filed 2014·Granted Mar 14, 2017·0 cites·14 claims
- 1452US11363724B1Fabrication method of flexible electronic package deviceIND TECH RES INST·Filed 2020·Granted Jun 14, 2022·0 cites·9 claims
- 1552US11061694B2Reconfigurable data bus system and method thereofIND TECH RES INST·Filed 2019·Granted Jul 13, 2021·0 cites·18 claims
- 1647US9030808B2Solid electrolytic capacitor and circuit board having the sameHSU CHIEN-MIN·Filed 2012·Granted May 12, 2015·0 cites·18 claims
- 1734US10129974B2Multi-layer circuit structureIND TECH RES INST·Filed 2016·Granted Nov 13, 2018·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →