Inventor · disambiguated record
Chih-Tai Hsu
Also filed as: HSU CHIH TAI
2 granted patents·5 pending applications·67 citations·filing 2006–2011
65Inventor score
Technology areasH10W
Files withCHEN NAN-CHENG2SILICON INTEGRATED SYS CORP2GREGORICH THOMAS MATTHEW1HSU CHIH-TAI1ZHONG XIN1
Top patents by PatentIndex Score
7 records- 0192US8093722B2System-in-package with fan-out WLCSPCHEN NAN-CHENG·Filed 2010·Granted Jan 10, 2012·51 cites·32 claims
- 0288US8310051B2Package-on-package with fan-out WLCSPCHEN NAN-CHENG·Filed 2011·Granted Nov 13, 2012·16 cites·24 claims
- 0339US2007057351A1Structure of IC packaging and method forming the sameSILICON INTEGRATED SYS CORP·Filed 2006·Application pending·0 cites
- 0437US2013133193A1Surface mount technology process for advanced quad flat no-lead package process and stencil used therewithHSU CHIH-TAI·Filed 2011·Application pending·0 cites
- 0537US2009029537A1Method for forming semiconductor package and mold cast used for the sameSILICON INTEGRATED SYS CORP·Filed 2007·Application pending·0 cites
- 0633US2012018498A1Pre-solder method and rework method for multi-row qfn chipZHONG XIN·Filed 2010·Application pending·0 cites
- 0733US2012140427A1Printed circuit board (pcb) assembly with advanced quad flat no-lead (a-qfn) packageGREGORICH THOMAS MATTHEW·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →